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NXP Semiconductors MCF54455CVP200 Microcontroller, Microprocessor, FPGA Modules

IC MCU 32BIT ROMLESS 360TEPBGA

6,588 ActiveNXP Semiconductors360-BBGARoHS
MCF54455CVP200 360-BBGA package illustration

Same model may have multiple batches, images only for reference.

MCF54455CVP200
Manufacturer
Part Number (MPN)
MCF54455CVP200
Detailed Description
IC MCU 32BIT ROMLESS 360TEPBGA
Package
360-BBGA
Key Features
Package / Case: 360-BBGA; Mounting Type: Surface Mount
Lifecycle Status
Active
RoHS State
RoHS Compliant
Datasheet
PDF MCF54455CVP200 Datasheet
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Technical Specifications

NXP Semiconductors MCF54455CVP200 Microcontroller, Microprocessor, FPGA Modules technical specifications.

General

RAM Size
32K x 8
RoHS
Yes
Package / Case
360-BBGA
Mounting Type
Surface Mount
Operating Temperature
-40°C ~ 85°C (TA)
Supply Voltage
1.35V ~ 3.6V
Lifecycle Status
Active
Peripherals
DMA, WDT
Number of I/O
132
Speed
200MHz

Alternate Parts Comparison (MCF54455CVP200 vs MCF54452VR266 vs MCF54452VR266R vs MCF54452CVR200)

Side-by-side technical parameter comparison of related primary models in this product family.

This PartAlternate PartsAlternate PartsAlternate Parts
Package / Case360-BBGA360-BBGA360-BBGA360-BBGA
Mounting TypeSurface MountSurface MountSurface MountSurface Mount
Operating Temperature-40°C ~ 85°C (TA)0°C ~ 70°C (TA)0°C ~ 70°C (TA)-40°C ~ 85°C (TA)
Supply Voltage1.35V ~ 3.6V1.35V ~ 3.6V1.35V ~ 3.6V1.35V ~ 3.6V
Core ProcessorColdfire V4Coldfire V4Coldfire V4Coldfire V4
Core Size32-Bit Single-Core32-Bit Single-Core32-Bit Single-Core32-Bit Single-Core
RAM Size32K x 832K x 832K x 832K x 8
ConnectivityI²C, SPI, SSI, UART/USART, USB OTGI²C, SPI, SSI, UART/USART, USB OTGI²C, SPI, SSI, UART/USART, USB OTGI²C, SPI, SSI, UART/USART, USB OTG
Number of I/O132132132132
Oscillator TypeExternal, InternalInternalInternalInternal
PeripheralsDMA, WDTDMA, WDTDMA, WDTDMA, WDT
Program Memory TypeROMlessROMlessROMlessROMless
Action

Cross Reference

Manufacturer-stated alternates from official cross-reference tools. These are not a guaranteed pin-compatible drop-in. Qualify package, pinout, and electrical limits against the datasheet before a board change. See cross-reference vs drop-in compatible .

This part is listed as a cross for

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