NXP Semiconductors MCF5207CVM166 Microcontroller, Microprocessor, FPGA Modules
IC MCU 32BIT ROMLESS 144MAPBGA
Same model may have multiple batches, images only for reference.
Manufacturer
Part Number (MPN)
MCF5207CVM166
Detailed Description
IC MCU 32BIT ROMLESS 144MAPBGA
Package
144-LBGA
Key Features
Package / Case: 144-LBGA; Mounting Type: Surface Mount
Lifecycle Status
Active
RoHS State
RoHS Compliant
Datasheet
MCF5207CVM166 Datasheet
Quick Jump:
Technical Specifications
NXP Semiconductors MCF5207CVM166 Microcontroller, Microprocessor, FPGA Modules technical specifications.
General
RAM Size
16K x 8
Package / Case
144-LBGA
Mounting Type
Surface Mount
Operating Temperature
-40°C ~ 85°C (TA)
Supply Voltage
1.4V ~ 3.6V
Peripherals
DMA, WDT
Number of I/O
30
Speed
166.67MHz
Core Processor
Coldfire V2
Program Memory Type
ROMless
Alternate Parts Comparison (MCF5207CVM166 vs MCF52256VN80J vs MC68VZ328VPR2 vs MK60DN512ZVMD10)
Side-by-side technical parameter comparison of related primary models in this product family.
| This Part | Alternate Parts | Alternate Parts | Alternate Parts | |
|---|---|---|---|---|
| Package / Case | 144-LBGA | 144-LBGA | 144-LBGA | 144-LBGA |
| Operating Temperature | -40°C ~ 85°C (TA) | 0°C ~ 70°C (TA) | 0°C ~ 70°C (TA) | -40°C ~ 105°C (TA) |
| Core Processor | Coldfire V2 | Coldfire V2 | FLX68000 | ARM® Cortex®-M4 |
| Speed | 166.67MHz | 80MHz | 33MHz | 100MHz |
| Supply Voltage | 1.4V ~ 3.6V | 3V ~ 3.6V | -- | 1.71V ~ 3.6V |
| Core Size | 32-Bit Single-Core | 32-Bit Single-Core | -- | 32-Bit Single-Core |
| RAM Size | 16K x 8 | 32K x 8 | -- | 128K x 8 |
| Connectivity | EBI/EMI, I²C, SPI, UART/USART | CANbus, EBI/EMI, Ethernet, I²C, QSPI, UART/USART, USB OTG | -- | CANbus, EBI/EMI, Ethernet, I²C, IrDA, SD, SPI, UART/USART, USB, USB OTG |
| Oscillator Type | External | Internal | -- | Internal |
| Peripherals | DMA, WDT | DMA, LVD, POR, PWM, WDT | -- | DMA, I²S, LVD, POR, PWM, WDT |
| Program Memory Type | ROMless | Flash | -- | Flash |
| Action |
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