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NXP Semiconductors MCF51AC256BCFGE Microcontroller, Microprocessor, FPGA Modules

IC MCU 32BIT 256KB FLASH 44LQFP

1,988 ActiveNXP Semiconductors44-LQFPRoHS
MCF51AC256BCFGE 44-LQFP package illustration

Same model may have multiple batches, images only for reference.

MCF51AC256BCFGE
Manufacturer
Part Number (MPN)
MCF51AC256BCFGE
Detailed Description
IC MCU 32BIT 256KB FLASH 44LQFP
Package
44-LQFP
Key Features
Package / Case: 44-LQFP; Mounting Type: Surface Mount
Lifecycle Status
Active
RoHS State
RoHS Compliant
Datasheet
PDF MCF51AC256BCFGE Datasheet
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Technical Specifications

NXP Semiconductors MCF51AC256BCFGE Microcontroller, Microprocessor, FPGA Modules technical specifications.

General

RAM Size
32K x 8
RoHS
Yes
Package / Case
44-LQFP
Mounting Type
Surface Mount
Operating Temperature
-40°C ~ 85°C (TA)
Supply Voltage
2.7V ~ 5.5V
Lifecycle Status
Active
Peripherals
LVD, PWM, WDT
Number of I/O
36
Speed
50MHz

Alternate Parts Comparison (MCF51AC256BCFGE vs MCF51JM128VLD,557 vs MCF51AC256BCFGER vs MCF51AC128CCFGER)

Side-by-side technical parameter comparison of related primary models in this product family.

This PartAlternate PartsAlternate PartsAlternate Parts
Package / Case44-LQFP44-LQFP44-LQFP44-LQFP
Operating Temperature-40°C ~ 85°C (TA)-40°C ~ 105°C (TA)-40°C ~ 85°C (TA)-40°C ~ 85°C (TA)
Supply Voltage2.7V ~ 5.5V2.7V ~ 5.5V2.7V ~ 5.5V2.7V ~ 5.5V
Core ProcessorColdfire V1Coldfire V1Coldfire V1Coldfire V1
Core Size32-Bit Single-Core32-Bit Single-Core32-Bit Single-Core32-Bit Single-Core
RAM Size32K x 816K x 832K x 816K x 8
Lifecycle StatusActiveActiveActiveActive
ConnectivityI²C, SCI, SPII²C, SCI, SPI, USB OTGI²C, SCI, SPII²C, SCI, SPI
Data ConvertersA/D 9x12bA/D 8x12bA/D 9x12bA/D 9x12b
Number of I/O36333636
Oscillator TypeExternalExternalExternalExternal
PeripheralsLVD, PWM, WDTLVD, PWM, WDTLVD, PWM, WDTLVD, PWM, WDT
Action

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