NXP Semiconductors MC9S12XDT256CAA Microcontroller, Microprocessor, FPGA Modules
IC MCU 16BIT 256KB FLASH 80QFP
Same model may have multiple batches, images only for reference.
Manufacturer
Part Number (MPN)
MC9S12XDT256CAA
Detailed Description
IC MCU 16BIT 256KB FLASH 80QFP
Package
80-QFP
Key Features
Package / Case: 80-QFP; Mounting Type: Surface Mount
Lifecycle Status
Active
RoHS State
RoHS Compliant
Datasheet
MC9S12XDT256CAA Datasheet
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Technical Specifications
NXP Semiconductors MC9S12XDT256CAA Microcontroller, Microprocessor, FPGA Modules technical specifications.
General
RAM Size
16K x 8
RoHS
True
Package / Case
80-QFP
Mounting Type
Surface Mount
Operating Temperature
-40°C ~ 85°C (TA)
Supply Voltage
2.35V ~ 5.5V
Lifecycle Status
Active
Peripherals
LVD, POR, PWM, WDT
Number of I/O
59
Speed
80MHz
Alternate Parts Comparison (MC9S12XDT256CAA vs MC711K4CFUE3 vs MC9S12B128MFUE vs MC68HC711K4CFU4)
Side-by-side technical parameter comparison of related primary models in this product family.
| This Part | Alternate Parts | Alternate Parts | Alternate Parts | |
|---|---|---|---|---|
| Package / Case | 80-QFP | 80-QFP | 80-QFP | 80-QFP |
| Mounting Type | Surface Mount | Surface Mount | Surface Mount | Surface Mount |
| Operating Temperature | -40°C ~ 85°C (TA) | -40°C ~ 85°C (TA) | -40°C ~ 125°C (TA) | -40°C ~ 85°C (TA) |
| Supply Voltage | 2.35V ~ 5.5V | 4.5V ~ 5.5V | 2.35V ~ 5.5V | 4.5V ~ 5.5V |
| Core Processor | HCS12X | HC11 | HCS12 | HC11 |
| Core Size | 16-Bit | 8-Bit | 16-Bit | 8-Bit |
| RAM Size | 16K x 8 | 768 x 8 | 4K x 8 | 768 x 8 |
| Connectivity | CANbus, EBI/EMI, I²C, IrDA, LINbus, SCI, SPI | SCI, SPI | CANbus, I²C, SCI, SPI | SCI, SPI |
| Data Converters | A/D 8x10b | A/D 8x8b | A/D 8x10b | A/D 8x8b |
| EEPROM Size | 4K x 8 | 640 x 8 | 1K x 8 | 640 x 8 |
| Number of I/O | 59 | 62 | 59 | 62 |
| Oscillator Type | External | Internal | Internal | Internal |
| Action |
Cross Reference
Manufacturer-stated alternates from official cross-reference tools. These are not a guaranteed pin-compatible drop-in. Qualify package, pinout, and electrical limits against the datasheet before a board change. See cross-reference vs drop-in compatible .
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