NXP Semiconductors MC9S12E128CFUE Microcontroller, Microprocessor, FPGA Modules
IC MCU 16BIT 128KB FLASH 80QFP
Same model may have multiple batches, images only for reference.
Manufacturer
Part Number (MPN)
MC9S12E128CFUE
Detailed Description
IC MCU 16BIT 128KB FLASH 80QFP
Package
80-QFP
Key Features
Package / Case: 80-QFP; Mounting Type: Surface Mount
Lifecycle Status
Active
RoHS State
RoHS Compliant
Datasheet
MC9S12E128CFUE Datasheet
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Technical Specifications
NXP Semiconductors MC9S12E128CFUE Microcontroller, Microprocessor, FPGA Modules technical specifications.
General
RAM Size
8K x 8
RoHS
True
Package / Case
80-QFP
Mounting Type
Surface Mount
Operating Temperature
-40°C ~ 85°C (TA)
Supply Voltage
2.35V ~ 2.75V
Lifecycle Status
Active
Peripherals
POR, PWM, WDT
Number of I/O
60
Speed
25MHz
Alternate Parts Comparison (MC9S12E128CFUE vs MC711K4CFUE3 vs MC9S12B128MFUE vs MC68HC711K4CFU4)
Side-by-side technical parameter comparison of related primary models in this product family.
| This Part | Alternate Parts | Alternate Parts | Alternate Parts | |
|---|---|---|---|---|
| Package / Case | 80-QFP | 80-QFP | 80-QFP | 80-QFP |
| Mounting Type | Surface Mount | Surface Mount | Surface Mount | Surface Mount |
| Operating Temperature | -40°C ~ 85°C (TA) | -40°C ~ 85°C (TA) | -40°C ~ 125°C (TA) | -40°C ~ 85°C (TA) |
| Supply Voltage | 2.35V ~ 2.75V | 4.5V ~ 5.5V | 2.35V ~ 5.5V | 4.5V ~ 5.5V |
| Core Processor | HCS12 | HC11 | HCS12 | HC11 |
| Core Size | 16-Bit | 8-Bit | 16-Bit | 8-Bit |
| RAM Size | 8K x 8 | 768 x 8 | 4K x 8 | 768 x 8 |
| Connectivity | EBI/EMI, I²C, SCI, SPI | SCI, SPI | CANbus, I²C, SCI, SPI | SCI, SPI |
| Data Converters | A/D 16x10b; D/A 2x8b | A/D 8x8b | A/D 8x10b | A/D 8x8b |
| Number of I/O | 60 | 62 | 59 | 62 |
| Oscillator Type | Internal | Internal | Internal | Internal |
| Peripherals | POR, PWM, WDT | POR, PWM, WDT | POR, PWM, WDT | POR, PWM, WDT |
| Action |
Cross Reference
Manufacturer-stated alternates from official cross-reference tools. These are not a guaranteed pin-compatible drop-in. Qualify package, pinout, and electrical limits against the datasheet before a board change. See cross-reference vs drop-in compatible .
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