NXP Semiconductors MC9S12C32MFAE25 Microcontroller, Microprocessor, FPGA Modules
IC MCU 16BIT 32KB FLASH 48LQFP

Same model may have multiple batches, images only for reference.
Manufacturer
Part Number (MPN)
MC9S12C32MFAE25
Detailed Description
IC MCU 16BIT 32KB FLASH 48LQFP
Package
48-LQFP
Key Features
Package / Case: 48-LQFP; Mounting Type: Surface Mount
Lifecycle Status
Active
RoHS State
RoHS Compliant
Datasheet
MC9S12C32MFAE25 Datasheet
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Technical Specifications
NXP Semiconductors MC9S12C32MFAE25 Microcontroller, Microprocessor, FPGA Modules technical specifications.
General
RAM Size
2K x 8
Package / Case
48-LQFP
Mounting Type
Surface Mount
Operating Temperature
-40°C ~ 125°C (TA)
Supply Voltage
2.35V ~ 5.5V
Lifecycle Status
Active
Peripherals
POR, PWM, WDT
Number of I/O
31
Speed
25MHz
Core Processor
HCS12
Alternate Parts Comparison (MC9S12C32MFAE25 vs MC908GZ48CFAE vs MM912F634CV2APR2 vs S9S12G128AVLF)
Side-by-side technical parameter comparison of related primary models in this product family.
| This Part | Alternate Parts | Alternate Parts | Alternate Parts | |
|---|---|---|---|---|
| Package / Case | 48-LQFP | 48-LQFP | 48-LQFP | 48-LQFP |
| Mounting Type | Surface Mount | Surface Mount | Surface Mount | Surface Mount |
| Operating Temperature | -40°C ~ 125°C (TA) | -40°C ~ 85°C (TA) | -40°C ~ 105°C | -40°C ~ 105°C (TA) |
| Supply Voltage | 2.35V ~ 5.5V | 3V ~ 5.5V | 2.25V ~ 5.5V | 3.13V ~ 5.5V |
| Core Processor | HCS12 | HC08 | S12 | 12V1 |
| RAM Size | 2K x 8 | 1.5K x 8 | 2K x 8 | 8K x 8 |
| Number of I/O | 31 | 37 | 9 | 40 |
| Program Memory Type | Flash | Flash | FLASH (32kB) | Flash |
| Core Size | 16-Bit | 8-Bit | -- | 16-Bit |
| Connectivity | CANbus, EBI/EMI, SCI, SPI | CANbus, SCI, SPI | -- | CANbus, IrDA, LINbus, SCI, SPI |
| Data Converters | A/D 8x10b | A/D 24x10b | -- | A/D 12x10b |
| Oscillator Type | Internal | Internal | -- | Internal |
| Action |
Cross Reference
Manufacturer-stated alternates from official cross-reference tools. These are not a guaranteed pin-compatible drop-in. Qualify package, pinout, and electrical limits against the datasheet before a board change. See cross-reference vs drop-in compatible .
This part is listed as a cross for
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