NXP Semiconductors MC9S08QG4CFFE Microcontroller, Microprocessor, FPGA Modules
IC MCU 8BIT 4KB FLASH 16QFN
Same model may have multiple batches, images only for reference.
Manufacturer
Part Number (MPN)
MC9S08QG4CFFE
Detailed Description
IC MCU 8BIT 4KB FLASH 16QFN
Package
16-VQFN Exposed Pad
Key Features
Package / Case: 16-VQFN Exposed Pad; Mounting Type: Surface Mount
Lifecycle Status
Active
RoHS State
RoHS Compliant
Datasheet
MC9S08QG4CFFE Datasheet
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Technical Specifications
NXP Semiconductors MC9S08QG4CFFE Microcontroller, Microprocessor, FPGA Modules technical specifications.
General
RAM Size
256 x 8
RoHS
True
Package / Case
16-VQFN Exposed Pad
Mounting Type
Surface Mount
Operating Temperature
-40°C ~ 85°C (TA)
Supply Voltage
1.8V ~ 3.6V
Lifecycle Status
Active
Peripherals
LVD, POR, PWM, WDT
Number of I/O
12
Speed
20MHz
Alternate Parts Comparison (MC9S08QG4CFFE vs MC705P6ACDWE vs MC711K4CFNE4 vs MC9S08QG84CFFER)
Side-by-side technical parameter comparison of related primary models in this product family.
| This Part | Alternate Parts | Alternate Parts | Alternate Parts | |
|---|---|---|---|---|
| Package / Case | 16-VQFN Exposed Pad | 28-SOIC | 84-LCC | 16-VQFN Exposed Pad |
| Mounting Type | Surface Mount | Surface Mount | Surface Mount | Surface Mount |
| Operating Temperature | -40°C ~ 85°C (TA) | -40°C ~ 85°C (TA) | -40°C ~ 85°C (TA) | -40°C ~ 85°C (TA) |
| Supply Voltage | 1.8V ~ 3.6V | 5 V | 4.5V ~ 5.5V | 1.8V ~ 3.6V |
| Core Processor | S08 | HC05 | HC11 | S08 |
| Core Size | 8-Bit | 8-Bit | 8-Bit | 8-Bit |
| RAM Size | 256 x 8 | 176 B | 768 x 8 | 512 x 8 |
| Connectivity | I²C, SCI, SPI | SIO | SCI, SPI | I²C, SCI, SPI |
| Data Converters | A/D 8x10b | A/D 4x8b | A/D 8x8b | A/D 8x10b |
| Number of I/O | 12 | 21 | 62 | 12 |
| Oscillator Type | Internal | Internal | Internal | Internal |
| Peripherals | LVD, POR, PWM, WDT | POR, WDT | POR, PWM, WDT | LVD, POR, PWM, WDT |
| Action |
Cross Reference
Manufacturer-stated alternates from official cross-reference tools. These are not a guaranteed pin-compatible drop-in. Qualify package, pinout, and electrical limits against the datasheet before a board change. See cross-reference vs drop-in compatible .
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