NXP Semiconductors MC9S08QD4MPC Microcontroller, Microprocessor, FPGA Modules
IC MCU 8BIT 4KB FLASH 8DIP
Same model may have multiple batches, images only for reference.
Manufacturer
Part Number (MPN)
MC9S08QD4MPC
Detailed Description
Package
8-DIP (0.300", 7.62mm)
Key Features
Package / Case: 8-DIP (0.300", 7.62mm); Mounting Type: Through Hole
Lifecycle Status
Obsolete
RoHS State
Compliant
Datasheet
MC9S08QD4MPC Datasheet
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Technical Specifications
NXP Semiconductors MC9S08QD4MPC Microcontroller, Microprocessor, FPGA Modules technical specifications.
General
Operating Temperature
-40°C ~ 125°C (TA)
Mounting Type
Through Hole
Package / Case
8-DIP (0.300", 7.62mm)
Supplier Device Package
8-PDIP
Peripherals
LVD, POR, PWM, WDT
Number of I/O
4
Speed
16MHz
Core Processor
S08
RAM Size
256 x 8
Program Memory Type
Flash
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