NXP Semiconductors MC9S08QD4CPC Microcontroller, Microprocessor, FPGA Modules
IC MCU 8BIT 4KB FLASH 8DIP
Same model may have multiple batches, images only for reference.
Manufacturer
Part Number (MPN)
MC9S08QD4CPC
Detailed Description
IC MCU 8BIT 4KB FLASH 8DIP
Package
8-DIP (0.300", 7.62mm)
Key Features
Package / Case: 8-DIP (0.300", 7.62mm); Mounting Type: Through Hole
Lifecycle Status
Obsolete
RoHS State
RoHS Compliant
Datasheet
MC9S08QD4CPC Datasheet
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Technical Specifications
NXP Semiconductors MC9S08QD4CPC Microcontroller, Microprocessor, FPGA Modules technical specifications.
General
RAM Size
256 x 8
Package / Case
8-DIP
Mounting Type
Through Hole
Operating Temperature
-40°C ~ 85°C (TA)
Supply Voltage
2.7V ~ 5.5V
Peripherals
LVD, POR, PWM, WDT
Number of I/O
4
Speed
16MHz
Core Processor
S08
Program Memory Type
Flash
Alternate Parts Comparison (MC9S08QD4CPC vs MC9RS08KA1CPC vs MC9S08QG44CPAE vs MC9S08QD2VPC)
Side-by-side technical parameter comparison of related primary models in this product family.
| This Part | Alternate Parts | Alternate Parts | Alternate Parts | |
|---|---|---|---|---|
| Package / Case | 8-DIP | 8-DIP | 8-DIP | 8-DIP |
| Mounting Type | Through Hole | Through Hole | Through Hole | Through Hole |
| Operating Temperature | -40°C ~ 85°C (TA) | -40°C ~ 85°C (TA) | -40°C ~ 85°C (TA) | -40°C ~ 105°C (TA) |
| Supply Voltage | 2.7V ~ 5.5V | 1.8V ~ 5.5V | 1.8V ~ 3.6V | 2.7V ~ 5.5V |
| Core Processor | S08 | RS08 | S08 | S08 |
| Core Size | 8-Bit | 8-Bit | 8-Bit | 8-Bit |
| RAM Size | 256 x 8 | 63 x 8 | 256 x 8 | 128 x 8 |
| Number of I/O | 4 | 4 | 4 | 4 |
| Oscillator Type | Internal | Internal | Internal | Internal |
| Peripherals | LVD, POR, PWM, WDT | LVD, POR, WDT | LVD, POR, PWM, WDT | LVD, POR, PWM, WDT |
| Program Memory Size | 4KB (4K x 8) | 1KB (1K x 8) | 4KB (4K x 8) | 2KB (2K x 8) |
| Program Memory Type | Flash | Flash | Flash | Flash |
| Action |
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