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NXP Semiconductors MC9S08PA60AVQH Microcontroller, Microprocessor, FPGA Modules

IC MCU 8BIT 60KB FLASH 64QFP

4,200 ActiveNXP Semiconductors64-QFPRoHS
MC9S08PA60AVQH - No Image Available

Same model may have multiple batches, images only for reference.

MC9S08PA60AVQH
Manufacturer
Part Number (MPN)
MC9S08PA60AVQH
Detailed Description
IC MCU 8BIT 60KB FLASH 64QFP
Package
64-QFP
Key Features
Package / Case: 64-QFP; Mounting Type: Surface Mount
Lifecycle Status
Active
RoHS State
RoHS Compliant
Datasheet
PDF MC9S08PA60AVQH Datasheet
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Technical Specifications

NXP Semiconductors MC9S08PA60AVQH Microcontroller, Microprocessor, FPGA Modules technical specifications.

General

RAM Size
4K x 8
Package / Case
64-QFP
Mounting Type
Surface Mount
Operating Temperature
-40°C ~ 105°C (TA)
Supply Voltage
2.7V ~ 5.5V
Peripherals
LVD, POR, PWM, WDT
Number of I/O
57
Speed
20MHz
EEPROM Size
256 x 8
Core Processor
S08

Alternate Parts Comparison (MC9S08PA60AVQH vs MC68SEC000CAA20 vs MC908GR32ACFUER vs MC9S08AC60CFUE)

Side-by-side technical parameter comparison of related primary models in this product family.

This PartAlternate PartsAlternate PartsAlternate Parts
Package / Case64-QFP64-QFP64-QFP64-QFP
Operating Temperature-40°C ~ 105°C (TA)-40°C ~ 85°C (TA)-40°C ~ 85°C (TA)-40°C ~ 85°C (TA)
Core ProcessorS08EC000HC08S08
Speed20MHz20MHz8MHz40MHz
Mounting TypeSurface Mount--Surface MountSurface Mount
Supply Voltage2.7V ~ 5.5V--3V ~ 5.5V2.7V ~ 5.5V
Core Size8-Bit--8-Bit8-Bit
RAM Size4K x 8--1.5K x 82K x 8
ConnectivityI²C, LINbus, SPI, UART/USART--SCI, SPII²C, SCI, SPI
Data ConvertersA/D 16x12b--A/D 24x10bA/D 16x10b
Number of I/O57--5354
Oscillator TypeInternal--InternalInternal
Action

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