NXP Semiconductors MC9S08PA32VLH Microcontroller, Microprocessor, FPGA Modules
IC MCU 8BIT 32KB FLASH 64LQFP
Same model may have multiple batches, images only for reference.
Manufacturer
Part Number (MPN)
MC9S08PA32VLH
Detailed Description
IC MCU 8BIT 32KB FLASH 64LQFP
Package
64-LQFP
Key Features
Package / Case: 64-LQFP; Mounting Type: Surface Mount
Lifecycle Status
Not For New Designs
RoHS State
RoHS Compliant
Datasheet
MC9S08PA32VLH Datasheet
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Technical Specifications
NXP Semiconductors MC9S08PA32VLH Microcontroller, Microprocessor, FPGA Modules technical specifications.
General
RAM Size
4K x 8
RoHS
True
Package / Case
64-LQFP
Mounting Type
Surface Mount
Operating Temperature
-40°C ~ 105°C (TA)
Supply Voltage
2.7V ~ 5.5V
Lifecycle Status
Not For New Designs
Peripherals
LVD, POR, PWM, WDT
Number of I/O
57
Speed
20MHz
Alternate Parts Comparison (MC9S08PA32VLH vs S9S12XS256J0VAER vs MCF51JM64EVLHR vs S9S12XS128J1VAE)
Side-by-side technical parameter comparison of related primary models in this product family.
| This Part | Alternate Parts | Alternate Parts | Alternate Parts | |
|---|---|---|---|---|
| Package / Case | 64-LQFP | 64-LQFP | 64-LQFP | 64-LQFP |
| Mounting Type | Surface Mount | Surface Mount | Surface Mount | Surface Mount |
| Operating Temperature | -40°C ~ 105°C (TA) | -40°C ~ 105°C (TA) | -40°C ~ 105°C (TA) | -40°C ~ 105°C (TA) |
| Supply Voltage | 2.7V ~ 5.5V | 1.72V ~ 5.5V | 2.7V ~ 5.5V | 1.72V ~ 5.5V |
| Core Processor | S08 | HCS12X | Coldfire V1 | HCS12X |
| Core Size | 8-Bit | 16-Bit | 32-Bit Single-Core | 16-Bit |
| RAM Size | 4K x 8 | 12K x 8 | 16K x 8 | 8K x 8 |
| Connectivity | I²C, LINbus, SPI, UART/USART | CANbus, SCI, SPI | CANbus, I²C, SCI, SPI, USB OTG | CANbus, SCI, SPI |
| Data Converters | A/D 16x12b | A/D 8x12b | A/D 12x12b | A/D 8x12b |
| Number of I/O | 57 | 44 | 51 | 59 |
| Oscillator Type | Internal | External | External | External |
| Peripherals | LVD, POR, PWM, WDT | LVD, POR, PWM, WDT | LVD, PWM, WDT | LVD, POR, PWM, WDT |
| Action |
Cross Reference
Manufacturer-stated alternates from official cross-reference tools. These are not a guaranteed pin-compatible drop-in. Qualify package, pinout, and electrical limits against the datasheet before a board change. See cross-reference vs drop-in compatible .
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