NXP Semiconductors MC9S08GB60CFU Microcontroller, Microprocessor, FPGA Modules
IC MCU 8BIT 60KB FLASH 64LQFP
Same model may have multiple batches, images only for reference.
Manufacturer
Part Number (MPN)
MC9S08GB60CFU
Detailed Description
IC MCU 8BIT 60KB FLASH 64LQFP
Package
64-LQFP
Key Features
Package / Case: 64-LQFP; Mounting Type: Surface Mount
Lifecycle Status
Obsolete
RoHS State
RoHS Compliant
Datasheet
MC9S08GB60CFU Datasheet
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Technical Specifications
NXP Semiconductors MC9S08GB60CFU Microcontroller, Microprocessor, FPGA Modules technical specifications.
General
RAM Size
4K x 8
RoHS
True
Number of Pins
64
Package / Case
64-LQFP
Mounting Type
Surface Mount
Operating Temperature
-40°C ~ 85°C (TA)
Supply Voltage
1.8V ~ 3.6V
Lifecycle Status
Obsolete
Peripherals
LVD, POR, PWM, WDT
Number of I/O
56
Alternate Parts Comparison (MC9S08GB60CFU vs S9S12P64J0VLHR vs SPC5602BK0MLH6R vs S9KEAZN16AMLHR)
Side-by-side technical parameter comparison of related primary models in this product family.
| This Part | Alternate Parts | Alternate Parts | Alternate Parts | |
|---|---|---|---|---|
| Package / Case | 64-LQFP | 64-LQFP | 64-LQFP | 64-LQFP |
| Mounting Type | Surface Mount | Surface Mount | Surface Mount | Surface Mount |
| Operating Temperature | -40°C ~ 85°C (TA) | -40°C ~ 105°C (TA) | -40°C ~ 125°C (TA) | -40°C ~ 125°C (TA) |
| Supply Voltage | 1.8V ~ 3.6V | 1.72V ~ 5.5V | 3V ~ 5.5V | 2.7V ~ 5.5V |
| Core Processor | S08 | HCS12 | e200z0h | ARM® Cortex®-M0+ |
| Core Size | 8-Bit | 16-Bit | 32-Bit Single-Core | 32-Bit Single-Core |
| RAM Size | 4K x 8 | 4K x 8 | 24K x 8 | 2K x 8 |
| Connectivity | I²C, SCI, SPI | CANbus, SCI, SPI | CANbus, I²C, LINbus, SCI, SPI | I²C, LINbus, SPI, UART/USART |
| Data Converters | A/D 8x10b | A/D 10x12b | A/D 12x10b | A/D 16x12b SAR |
| Number of I/O | 56 | 49 | 45 | 57 |
| Oscillator Type | Internal | Internal | Internal | Internal |
| Peripherals | LVD, POR, PWM, WDT | LVD, POR, PWM, WDT | DMA, POR, PWM, WDT | LVD, POR, PWM, WDT |
| Action |
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