NXP Semiconductors MC9S08AW60MFUE Microcontroller, Microprocessor, FPGA Modules
IC MCU 8BIT 60KB FLASH 64QFP
Same model may have multiple batches, images only for reference.
Manufacturer
Part Number (MPN)
MC9S08AW60MFUE
Detailed Description
IC MCU 8BIT 60KB FLASH 64QFP
Package
64-QFP
Key Features
Package / Case: 64-QFP; Mounting Type: Surface Mount
Lifecycle Status
Active
RoHS State
RoHS Compliant
Datasheet
MC9S08AW60MFUE Datasheet
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Technical Specifications
NXP Semiconductors MC9S08AW60MFUE Microcontroller, Microprocessor, FPGA Modules technical specifications.
General
RAM Size
2K x 8
RoHS
Yes
Package / Case
64-QFP
Mounting Type
Surface Mount
Operating Temperature
-40°C ~ 125°C (TA)
Supply Voltage
2.7V ~ 5.5V
Lifecycle Status
Active
Peripherals
LVD, POR, PWM, WDT
Number of I/O
54
Speed
40MHz
Related Parts Comparison (MC9S08AW60MFUE vs MC68SEC000CAA20 vs MC908GR32ACFUER vs MC9S08AC60CFUE)
Side-by-side specifications of related catalog parts.
Engineering verification required. Related parts may have different electrical ratings, pinouts, footprints, and operating limits. Verify suitability for your circuit before substitution.
| This Part | Related Part | Related Part | Related Part | |
|---|---|---|---|---|
| Package / Case | 64-QFP | 64-QFP | 64-QFP | 64-QFP |
| Operating Temperature | -40°C ~ 125°C (TA) | -40°C ~ 85°C (TA) | -40°C ~ 85°C (TA) | -40°C ~ 85°C (TA) |
| Core Processor | S08 | EC000 | HC08 | S08 |
| RoHS | Yes | Yes | Yes | Yes |
| Lifecycle Status | Active | Obsolete | Obsolete | Active |
| Package | SOT1697-1 | PQFP-64 | 64-QFP | LQFP-64 |
| Speed | 40MHz | 20MHz | 8MHz | 40MHz |
| Mounting Type | Surface Mount | -- | Surface Mount | Surface Mount |
| Supply Voltage | 2.7V ~ 5.5V | -- | 3V ~ 5.5V | 2.7V ~ 5.5V |
| Core Size | 8-Bit | -- | 8-Bit | 8-Bit |
| RAM Size | 2K x 8 | -- | 1.5K x 8 | 2K x 8 |
| Connectivity | I²C, SCI, SPI | -- | SCI, SPI | I²C, SCI, SPI |
| Action |
Cross Reference
Manufacturer-stated alternates from official cross-reference tools. These are not a guaranteed pin-compatible drop-in. Qualify package, pinout, and electrical limits against the datasheet before a board change. See cross-reference vs drop-in compatible .
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