NXP Semiconductors MC9S08AC8CFGE Microcontroller, Microprocessor, FPGA Modules
IC MCU 8BIT 8KB FLASH 44LQFP
Same model may have multiple batches, images only for reference.
Manufacturer
Part Number (MPN)
MC9S08AC8CFGE
Detailed Description
IC MCU 8BIT 8KB FLASH 44LQFP
Package
44-LQFP
Key Features
Package / Case: 44-LQFP; Mounting Type: Surface Mount
Lifecycle Status
Active
RoHS State
RoHS Compliant
Datasheet
MC9S08AC8CFGE Datasheet
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Technical Specifications
NXP Semiconductors MC9S08AC8CFGE Microcontroller, Microprocessor, FPGA Modules technical specifications.
General
RAM Size
768 x 8
RoHS
True
Number of Pins
44
Package / Case
44-LQFP
Mounting Type
Surface Mount
Operating Temperature
-40°C ~ 85°C (TA)
Supply Voltage
2.7V ~ 5.5V
Lifecycle Status
Active
Peripherals
LVD, POR, PWM, WDT
Number of I/O
34
Alternate Parts Comparison (MC9S08AC8CFGE vs MC9S08AC60CFGE vs MC9S08AC16CFGE vs MC9S08AW32CFGER)
Side-by-side technical parameter comparison of related primary models in this product family.
| This Part | Alternate Parts | Alternate Parts | Alternate Parts | |
|---|---|---|---|---|
| Package / Case | 44-LQFP | 44-LQFP | 44-LQFP | 44-LQFP |
| Mounting Type | Surface Mount | Surface Mount | Surface Mount | Surface Mount |
| Operating Temperature | -40°C ~ 85°C (TA) | -40°C ~ 85°C (TA) | -40°C ~ 85°C (TA) | -40°C ~ 85°C (TA) |
| Supply Voltage | 2.7V ~ 5.5V | 2.7V ~ 5.5V | 2.7V ~ 5.5V | 2.7V ~ 5.5V |
| Core Processor | S08 | S08 | S08 | S08 |
| Core Size | 8-Bit | 8-Bit | 8-Bit | 8-Bit |
| RAM Size | 768 x 8 | 2K x 8 | 1K x 8 | 2K x 8 |
| Connectivity | I²C, SCI, SPI | I²C, SCI, SPI | I²C, SCI, SPI | I²C, SCI, SPI |
| Data Converters | A/D 8x10b | A/D 8x10b | A/D 8x10b | A/D 8x10b |
| Number of I/O | 34 | 34 | 34 | 34 |
| Oscillator Type | Internal | Internal | Internal | Internal |
| Peripherals | LVD, POR, PWM, WDT | LVD, POR, PWM, WDT | LVD, POR, PWM, WDT | LVD, POR, PWM, WDT |
| Action |
Cross Reference
Manufacturer-stated alternates from official cross-reference tools. These are not a guaranteed pin-compatible drop-in. Qualify package, pinout, and electrical limits against the datasheet before a board change. See cross-reference vs drop-in compatible .
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