NXP Semiconductors MC92501GC Telecom
IC TELECOM INTERFACE 256BGA
Same model may have multiple batches, images only for reference.
Manufacturer
Part Number (MPN)
MC92501GC
Detailed Description
IC TELECOM INTERFACE 256BGA
Package
256-BBGA
Key Features
Package / Case: 256-BBGA; Mounting Type: Surface Mount
Lifecycle Status
Obsolete
RoHS State
RoHS Compliant
Datasheet
MC92501GC Datasheet
Quick Jump:
Technical Specifications
NXP Semiconductors MC92501GC Telecom technical specifications.
General
Interface
JTAG, PHY, UTOPIA
Package / Case
256-BBGA
Mounting Type
Surface Mount
Operating Temperature
-40°C ~ 85°C
Supply Voltage
3V ~ 3.6V
Current Supply
300mA
Number of Circuits
1
Function
Asynchronous Transfer Mode (ATM) Cell Processor
Alternate Parts Comparison (MC92501GC vs MC711K4CFNE4 vs MC9S12D64VPVER vs MC9S12HZ64CAA)
Side-by-side technical parameter comparison of related primary models in this product family.
| This Part | Alternate Parts | Alternate Parts | Alternate Parts | |
|---|---|---|---|---|
| Package / Case | 256-BBGA | 84-LCC | 112-LQFP | 80-QFP |
| Mounting Type | Surface Mount | Surface Mount | Surface Mount | Surface Mount |
| Operating Temperature | -40°C ~ 85°C | -40°C ~ 85°C (TA) | -40°C ~ 105°C (TA) | -40°C ~ 85°C (TA) |
| Supply Voltage | 3V ~ 3.6V | 4.5V ~ 5.5V | 2.35V ~ 5.25V | 2.35V ~ 5.5V |
| Series | -- | HC11 | HCS12 | HCS12 |
| Core Processor | -- | HC11 | HCS12 | HCS12 |
| Core Size | -- | 8-Bit | 16-Bit | 16-Bit |
| RAM Size | -- | 768 x 8 | 4K x 8 | 4K x 8 |
| Connectivity | -- | SCI, SPI | CANbus, I²C, SCI, SPI | CANbus, EBI/EMI, I²C, SCI, SPI |
| Data Converters | -- | A/D 8x8b | A/D 8x10b | A/D 16x10b |
| EEPROM Size | -- | 640 x 8 | 1K x 8 | 1K x 8 |
| Number of I/O | -- | 62 | 91 | 59 |
| Action |
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