NXP Semiconductors MC68HC705P6ACP Microcontroller, Microprocessor, FPGA Modules
IC MCU 8BIT 4.5KB OTP 28DIP
Same model may have multiple batches, images only for reference.
Manufacturer
Part Number (MPN)
MC68HC705P6ACP
Detailed Description
Package
28-DIP (0.600", 15.24mm)
Key Features
Package / Case: 28-DIP (0.600", 15.24mm); Mounting Type: Through Hole
Lifecycle Status
Obsolete
RoHS State
Compliant
Datasheet
MC68HC705P6ACP Datasheet
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Technical Specifications
NXP Semiconductors MC68HC705P6ACP Microcontroller, Microprocessor, FPGA Modules technical specifications.
General
Operating Temperature
-40°C ~ 85°C (TA)
Mounting Type
Through Hole
Package / Case
28-DIP (0.600", 15.24mm)
Supplier Device Package
28-PDIP
Peripherals
POR, WDT
Number of I/O
21
Speed
2.1MHz
Core Processor
HC05
RAM Size
176 x 8
Program Memory Type
OTP
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