NXP Semiconductors MC68HC16Z1CEH25 Microcontroller, Microprocessor, FPGA Modules
IC MCU 16BIT ROMLESS 132PQFP
Same model may have multiple batches, images only for reference.
Manufacturer
Part Number (MPN)
MC68HC16Z1CEH25
Detailed Description
IC MCU 16BIT ROMLESS 132PQFP
Package
132-BQFP Bumpered
Key Features
Package / Case: 132-BQFP Bumpered; Mounting Type: Surface Mount
Lifecycle Status
NRND
RoHS State
RoHS Compliant
Datasheet
MC68HC16Z1CEH25 Datasheet
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Technical Specifications
NXP Semiconductors MC68HC16Z1CEH25 Microcontroller, Microprocessor, FPGA Modules technical specifications.
General
RAM Size
1K x 8
Package / Case
132-BQFP Bumpered
Mounting Type
Surface Mount
Operating Temperature
-40°C ~ 85°C (TA)
Supply Voltage
2.7V ~ 5.5V
Peripherals
POR, PWM, WDT
Number of I/O
16
Speed
25MHz
Core Processor
CPU16
Program Memory Type
ROMless
Alternate Parts Comparison (MC68HC16Z1CEH25 vs MC68302EH16CR2 vs MC68302EH25CR2 vs MC68302EH20CB1)
Side-by-side technical parameter comparison of related primary models in this product family.
| This Part | Alternate Parts | Alternate Parts | Alternate Parts | |
|---|---|---|---|---|
| Package / Case | 132-BQFP Bumpered | 132-BQFP Bumpered | 132-BQFP Bumpered | 132-BQFP Bumpered |
| Operating Temperature | -40°C ~ 85°C (TA) | 0°C ~ 70°C (TA) | 0°C ~ 70°C (TA) | 0°C ~ 70°C (TA) |
| Core Processor | CPU16 | M68000 | M68000 | M68000 |
| Speed | 25MHz | 16MHz | 25MHz | 20MHz |
| Co Processors DSP | -- | Communications; RISC CPM | Communications; RISC CPM | Communications; RISC CPM |
| Graphics Acceleration | -- | No | No | No |
| Number of Cores Bus Width | -- | 1 Core, 8/16-Bit | 1 Core, 8/16-Bit | 1 Core, 8/16-Bit |
| RAM Controllers | -- | DRAM | DRAM | DRAM |
| Voltage IO | -- | 5.0V | 5.0V | 5.0V |
| Action |
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