NXP Semiconductors MC56F8256MLF Microcontroller, Microprocessor, FPGA Modules
IC MCU 16BIT 64KB FLASH 48LQFP

Same model may have multiple batches, images only for reference.
Manufacturer
Part Number (MPN)
MC56F8256MLF
Detailed Description
IC MCU 16BIT 64KB FLASH 48LQFP
Package
48-LQFP
Key Features
Package / Case: 48-LQFP; Mounting Type: Surface Mount
Lifecycle Status
Active
RoHS State
RoHS Compliant
Datasheet
MC56F8256MLF Datasheet
Quick Jump:
Technical Specifications
NXP Semiconductors MC56F8256MLF Microcontroller, Microprocessor, FPGA Modules technical specifications.
General
RAM Size
4K x 16
Package / Case
48-LQFP
Mounting Type
Surface Mount
Operating Temperature
-40°C ~ 105°C
Supply Voltage
3V ~ 3.6V
Lifecycle Status
Active
Peripherals
LVD, POR, PWM, WDT
Number of I/O
39
Speed
60MHz
Core Processor
56800E
Alternate Parts Comparison (MC56F8256MLF vs MC908GZ48CFAE vs MM912F634CV2APR2 vs S9S12G128AVLF)
Side-by-side technical parameter comparison of related primary models in this product family.
| This Part | Alternate Parts | Alternate Parts | Alternate Parts | |
|---|---|---|---|---|
| Package / Case | 48-LQFP | 48-LQFP | 48-LQFP | 48-LQFP |
| Mounting Type | Surface Mount | Surface Mount | Surface Mount | Surface Mount |
| Operating Temperature | -40°C ~ 105°C | -40°C ~ 85°C (TA) | -40°C ~ 105°C | -40°C ~ 105°C (TA) |
| Supply Voltage | 3V ~ 3.6V | 3V ~ 5.5V | 2.25V ~ 5.5V | 3.13V ~ 5.5V |
| Core Processor | 56800E | HC08 | S12 | 12V1 |
| RAM Size | 4K x 16 | 1.5K x 8 | 2K x 8 | 8K x 8 |
| Number of I/O | 39 | 37 | 9 | 40 |
| Program Memory Type | Flash | Flash | FLASH (32kB) | Flash |
| Core Size | 16-Bit | 8-Bit | -- | 16-Bit |
| Connectivity | CANbus, I²C, LINbus, SCI, SPI | CANbus, SCI, SPI | -- | CANbus, IrDA, LINbus, SCI, SPI |
| Data Converters | A/D 10x12b; D/A 1x12b | A/D 24x10b | -- | A/D 12x10b |
| Oscillator Type | Internal | Internal | -- | Internal |
| Action |
Cross Reference
Manufacturer-stated alternates from official cross-reference tools. These are not a guaranteed pin-compatible drop-in. Qualify package, pinout, and electrical limits against the datasheet before a board change. See cross-reference vs drop-in compatible .
This part is listed as a cross for
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