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NXP Semiconductors MC33PF8200DMES Power Management - Specialized

POWER MANAGEMENT IC I.MX8 PRE-PR

521 ActiveNXP Semiconductors56-VFQFN Exposed PadRoHS
MC33PF8200DMES - No Image Available

Same model may have multiple batches, images only for reference.

MC33PF8200DMES
Manufacturer
Part Number (MPN)
MC33PF8200DMES
Detailed Description
Package
56-VFQFN Exposed Pad
Key Features
Package / Case: 56-VFQFN Exposed Pad; Mounting Type: Surface Mount, Wettable Flank
Lifecycle Status
Active
RoHS State
Compliant
Datasheet
PDF MC33PF8200DMES Datasheet
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Technical Specifications

NXP Semiconductors MC33PF8200DMES Power Management - Specialized technical specifications.

General

Operating Temperature
-40°C ~ 105°C (TA)
Mounting Type
Surface Mount, Wettable Flank
Package / Case
56-VFQFN Exposed Pad
Supplier Device Package
56-HVQFN (8x8)
Supply Voltage
2.5V ~ 5.5V
Applications
High Performance i.MX 8, S32x Processor Based

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