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NXP Semiconductors MC33926AES Motor Drivers, Controllers

H-BRIDGE, BRUSHED DC MOTOR DRIVE

8,504 ActiveNXP Semiconductors10-WFDFN Exposed PadRoHS
MC33926AES - No Image Available

Same model may have multiple batches, images only for reference.

MC33926AES
Manufacturer
Part Number (MPN)
MC33926AES
Detailed Description
H-BRIDGE, BRUSHED DC MOTOR DRIVE
Package
10-WFDFN Exposed Pad
Key Features
Package / Case: 10-WFDFN Exposed Pad; Mounting Type: Surface Mount, Wettable Flank
Lifecycle Status
Active
RoHS State
RoHS Compliant
Datasheet
PDF MC33926AES Datasheet
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Technical Specifications

NXP Semiconductors MC33926AES Motor Drivers, Controllers technical specifications.

General

Interface
Parallel
Package / Case
10-WFDFN Exposed Pad
Mounting Type
Surface Mount, Wettable Flank
Operating Temperature
-40°C ~ 125°C (TA)
Supply Voltage
5V ~ 28V
Technology
CMOS
Output Current
5A
Output Configuration
Half Bridge (2)
Voltage Load
5V ~ 28V
Motor Type Stepper
Bipolar

Alternate Parts Comparison (MC33926AES vs MC711K4CFNE4 vs MC9S12D64VPVER vs MC9S12HZ64CAA)

Side-by-side technical parameter comparison of related primary models in this product family.

This PartAlternate PartsAlternate PartsAlternate Parts
Package / Case10-WFDFN Exposed Pad84-LCC112-LQFP80-QFP
Mounting TypeSurface Mount, Wettable FlankSurface MountSurface MountSurface Mount
Operating Temperature-40°C ~ 125°C (TA)-40°C ~ 85°C (TA)-40°C ~ 105°C (TA)-40°C ~ 85°C (TA)
Supply Voltage5V ~ 28V4.5V ~ 5.5V2.35V ~ 5.25V2.35V ~ 5.5V
Series--HC11HCS12HCS12
Core Processor--HC11HCS12HCS12
Core Size--8-Bit16-Bit16-Bit
RAM Size--768 x 84K x 84K x 8
Connectivity--SCI, SPICANbus, I²C, SCI, SPICANbus, EBI/EMI, I²C, SCI, SPI
Data Converters--A/D 8x8bA/D 8x10bA/D 16x10b
EEPROM Size--640 x 81K x 81K x 8
Number of I/O--629159
Action

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