NXP Semiconductors LPC812M101JD20J Microcontroller, Microprocessor, FPGA Modules
IC MCU 32BIT 16KB FLASH 20SO
Same model may have multiple batches, images only for reference.
Manufacturer
Part Number (MPN)
LPC812M101JD20J
Detailed Description
IC MCU 32BIT 16KB FLASH 20SO
Package
20-SOIC (0.295", 7.50mm Width)
Key Features
Package / Case: 20-SOIC (0.295", 7.50mm Width); Mounting Type: Surface Mount
Lifecycle Status
Active
RoHS State
RoHS Compliant
Datasheet
LPC812M101JD20J Datasheet
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Technical Specifications
NXP Semiconductors LPC812M101JD20J Microcontroller, Microprocessor, FPGA Modules technical specifications.
General
RAM Size
4K x 8
RoHS
Yes
Package / Case
20-SOIC
Mounting Type
Surface Mount
Operating Temperature
-40°C ~ 105°C (TA)
Supply Voltage
1.8V ~ 3.6V
Lifecycle Status
Active
Peripherals
Brown-out Detect/Reset, POR, PWM, WDT
Number of I/O
18
Speed
30MHz
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Side-by-side specifications of related catalog parts.
Engineering verification required. Related parts may have different electrical ratings, pinouts, footprints, and operating limits. Verify suitability for your circuit before substitution.
| This Part | Related Part | Related Part | Related Part | |
|---|---|---|---|---|
| Package / Case | 20-SOIC | 20-SOIC | 20-SOIC | 20-SOIC |
| Mounting Type | Surface Mount | Surface Mount | Surface Mount | Surface Mount |
| Operating Temperature | -40°C ~ 105°C (TA) | -40°C ~ 85°C (TA) | -40°C ~ 85°C (TA) | -40°C ~ 85°C (TA) |
| Supply Voltage | 1.8V ~ 3.6V | 2.7V ~ 3.3V | 2.7V ~ 3.3V | 2.7V ~ 3.3V |
| Core Processor | ARM® Cortex®-M0+ | HC08 | HC08 | HC08 |
| Core Size | 32-Bit Single-Core | 8-Bit | 8-Bit | 8-Bit |
| RAM Size | 4K x 8 | 128 x 8 | 128 x 8 | 128 x 8 |
| RoHS | Yes | Yes | Yes | Yes |
| Lifecycle Status | Active | Obsolete | Obsolete | Not For New Designs |
| Number of I/O | 18 | 15 | 15 | 15 |
| Oscillator Type | Internal | External | External | External |
| Package | SOIC-20 | 20-SOIC (0.295", 7.50mm Width) | 20-SOIC | SOT163-5 |
| Action |
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