NXP Semiconductors LPC812M101FDH16FP Microcontroller, Microprocessor, FPGA Modules
IC MCU 32BIT 16KB FLASH 16TSSOP
Same model may have multiple batches, images only for reference.
Manufacturer
Part Number (MPN)
LPC812M101FDH16FP
Detailed Description
IC MCU 32BIT 16KB FLASH 16TSSOP
Package
16-TSSOP (0.173", 4.40mm Width)
Key Features
Package / Case: 16-TSSOP (0.173", 4.40mm Width); Mounting Type: Surface Mount
Lifecycle Status
Obsolete
RoHS State
RoHS Compliant
Datasheet
LPC812M101FDH16FP Datasheet
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Technical Specifications
NXP Semiconductors LPC812M101FDH16FP Microcontroller, Microprocessor, FPGA Modules technical specifications.
General
RAM Size
4K x 8
Package / Case
16-TSSOP
Mounting Type
Surface Mount
Operating Temperature
-40°C ~ 105°C (TA)
Supply Voltage
1.8V ~ 3.6V
Peripherals
Brown-out Detect/Reset, POR, PWM, WDT
Number of I/O
14
Speed
30MHz
Core Processor
ARM® Cortex®-M0+
Program Memory Type
Flash
Alternate Parts Comparison (LPC812M101FDH16FP vs PCA9557PW,118 vs MC68HC908QY2CDT vs MC9S08PA4MTG)
Side-by-side technical parameter comparison of related primary models in this product family.
| This Part | Alternate Parts | Alternate Parts | Alternate Parts | |
|---|---|---|---|---|
| Package / Case | 16-TSSOP | 16-TSSOP | 16-TSSOP | 16-TSSOP |
| Mounting Type | Surface Mount | Surface Mount | Surface Mount | Surface Mount |
| Operating Temperature | -40°C ~ 105°C (TA) | -40°C ~ 85°C | -40°C ~ 85°C (TA) | -40°C ~ 125°C (TA) |
| Supply Voltage | 1.8V ~ 3.6V | 2.3V ~ 5.5V | 2.7V ~ 5.5V | 2.7V ~ 5.5V |
| Number of I/O | 14 | 8 | 13 | 14 |
| Core Processor | ARM® Cortex®-M0+ | -- | HC08 | S08 |
| Core Size | 32-Bit Single-Core | -- | 8-Bit | 8-Bit |
| RAM Size | 4K x 8 | -- | 128 x 8 | 512 x 8 |
| Oscillator Type | Internal | -- | Internal | Internal |
| Peripherals | Brown-out Detect/Reset, POR, PWM, WDT | -- | LVD, POR, PWM | LVD, POR, PWM, WDT |
| Program Memory Size | 16KB (16K x 8) | -- | 1.5KB (1.5K x 8) | 4KB (4K x 8) |
| Program Memory Type | Flash | -- | Flash | Flash |
| Action |
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