NXP Semiconductors LPC812M101FD20FP Microcontroller, Microprocessor, FPGA Modules
IC MCU 32BIT 16KB FLASH 20SO
Same model may have multiple batches, images only for reference.
Manufacturer
Part Number (MPN)
LPC812M101FD20FP
Detailed Description
IC MCU 32BIT 16KB FLASH 20SO
Package
20-SOIC (0.295", 7.50mm Width)
Key Features
Package / Case: 20-SOIC (0.295", 7.50mm Width); Mounting Type: Surface Mount
Lifecycle Status
Obsolete
RoHS State
RoHS Compliant
Datasheet
LPC812M101FD20FP Datasheet
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Technical Specifications
NXP Semiconductors LPC812M101FD20FP Microcontroller, Microprocessor, FPGA Modules technical specifications.
General
RAM Size
4K x 8
RoHS
Yes
Number of Pins
20
Package / Case
20-SOIC
Mounting Type
Surface Mount
Operating Temperature
-40°C ~ 105°C (TA)
Supply Voltage
1.8V ~ 3.6V
Lifecycle Status
Obsolete
Peripherals
Brown-out Detect/Reset, POR, PWM, WDT
Number of I/O
18
Alternate Parts Comparison (LPC812M101FD20FP vs MC68HRC908JK1CDW vs MC68HRC98JK3ECDW vs MC908JK3ECDWE)
Side-by-side technical parameter comparison of related primary models in this product family.
| This Part | Alternate Parts | Alternate Parts | Alternate Parts | |
|---|---|---|---|---|
| Package / Case | 20-SOIC | 20-SOIC | 20-SOIC | 20-SOIC |
| Mounting Type | Surface Mount | Surface Mount | Surface Mount | Surface Mount |
| Operating Temperature | -40°C ~ 105°C (TA) | -40°C ~ 85°C (TA) | -40°C ~ 85°C (TA) | -40°C ~ 85°C (TA) |
| Supply Voltage | 1.8V ~ 3.6V | 2.7V ~ 3.3V | 2.7V ~ 3.3V | 2.7V ~ 3.3V |
| Core Processor | ARM® Cortex®-M0+ | HC08 | HC08 | HC08 |
| Core Size | 32-Bit Single-Core | 8-Bit | 8-Bit | 8-Bit |
| RAM Size | 4K x 8 | 128 x 8 | 128 x 8 | 128 x 8 |
| RoHS | Yes | Yes | Yes | Yes |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Not For New Designs |
| Number of I/O | 18 | 15 | 15 | 15 |
| Oscillator Type | Internal | External | External | External |
| Package | SOIC-20 | 20-SOIC (0.295", 7.50mm Width) | 20-SOIC | SOT163-5 |
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