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NXP Semiconductors LPC802M001JDH16FP Microcontroller, Microprocessor, FPGA Modules

IC MCU 32BIT 16KB FLASH 16TSSOP

29,710 ActiveNXP Semiconductors16-TSSOP (0.173", 4.40mm Width)RoHS
LPC802M001JDH16FP 16-TSSOP (0.173", 4.40mm Width) package illustration

Same model may have multiple batches, images only for reference.

LPC802M001JDH16FP
Manufacturer
Part Number (MPN)
LPC802M001JDH16FP
Detailed Description
IC MCU 32BIT 16KB FLASH 16TSSOP
Package
16-TSSOP (0.173", 4.40mm Width)
Key Features
Package / Case: 16-TSSOP (0.173", 4.40mm Width); Mounting Type: Surface Mount
Lifecycle Status
Active
RoHS State
RoHS Compliant
Datasheet
PDF LPC802M001JDH16FP Datasheet
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Technical Specifications

NXP Semiconductors LPC802M001JDH16FP Microcontroller, Microprocessor, FPGA Modules technical specifications.

General

RAM Size
2K x 8
RoHS
Yes
Package / Case
16-TSSOP
Mounting Type
Surface Mount
Operating Temperature
-40°C ~ 105°C (TA)
Supply Voltage
1.71V ~ 3.6V
Lifecycle Status
Active
Peripherals
Brown-out Detect/Reset, POR, PWM, WDT
Number of I/O
13
Speed
15MHz

Alternate Parts Comparison (LPC802M001JDH16FP vs PCA9557PW,118 vs MC68HC908QY2CDT vs MC9S08PA4MTG)

Side-by-side technical parameter comparison of related primary models in this product family.

This PartAlternate PartsAlternate PartsAlternate Parts
Package / Case16-TSSOP16-TSSOP16-TSSOP16-TSSOP
Mounting TypeSurface MountSurface MountSurface MountSurface Mount
Operating Temperature-40°C ~ 105°C (TA)-40°C ~ 85°C-40°C ~ 85°C (TA)-40°C ~ 125°C (TA)
Supply Voltage1.71V ~ 3.6V2.3V ~ 5.5V2.7V ~ 5.5V2.7V ~ 5.5V
RoHSYesYesYesYes
Lifecycle StatusActiveActiveObsoleteActive
Number of I/O1381314
PackageTSSOP-16TSSOP-1616-TSSOPTSSOP-16
Core ProcessorARM® Cortex®-M0+--HC08S08
Core Size32-Bit Single-Core--8-Bit8-Bit
RAM Size2K x 8--128 x 8512 x 8
Data ConvertersA/D 12x12b--A/D 4x8bA/D 8x12b
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