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NXP Semiconductors LPC55S26JBD64K Microcontroller, Microprocessor, FPGA Modules

IC MCU 32BIT 256KB FLASH 64HTQFP

13,086 ActiveNXP Semiconductors64-TQFP Exposed PadRoHS
LPC55S26JBD64K 64-TQFP Exposed Pad package illustration

Same model may have multiple batches, images only for reference.

LPC55S26JBD64K
Manufacturer
Part Number (MPN)
LPC55S26JBD64K
Detailed Description
IC MCU 32BIT 256KB FLASH 64HTQFP
Package
64-TQFP Exposed Pad
Key Features
Package / Case: 64-TQFP Exposed Pad; Mounting Type: Surface Mount
Lifecycle Status
Active
RoHS State
RoHS Compliant
Datasheet
PDF LPC55S26JBD64K Datasheet
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Technical Specifications

NXP Semiconductors LPC55S26JBD64K Microcontroller, Microprocessor, FPGA Modules technical specifications.

General

Series
LPC55S2x
RAM Size
144K x 8
Data Bus Width
32 bit
Maximum Clock Frequency
150 MHz
RoHS
Yes
Package / Case
64-TQFP Exposed Pad
Mounting Type
Surface Mount
Operating Temperature
-40°C ~ 105°C (TA)
Supply Voltage
1.8V ~ 3.6V
Lifecycle Status
Active

Alternate Parts Comparison (LPC55S26JBD64K vs LPC5516JBD64K vs LPC5504JBD64E vs LPC55S66JBD64E)

Side-by-side technical parameter comparison of related primary models in this product family.

This PartAlternate PartsAlternate PartsAlternate Parts
SeriesLPC55S2xLPC551xLPC550xLPC55S6x
Package / Case64-TQFP Exposed Pad64-TQFP Exposed Pad64-TQFP Exposed Pad64-TQFP Exposed Pad
Operating Temperature-40°C ~ 105°C (TA)-40°C ~ 105°C (TA)-40°C ~ 105°C (TA)-40°C ~ 105°C (TA)
Supply Voltage1.8V ~ 3.6V1.8V ~ 3.6V1.8V ~ 3.6V1.8V ~ 3.6V
Core ProcessorARM® Cortex®-M33ARM® Cortex®-M33ARM® Cortex®-M33ARM® Cortex®-M33
Core Size32-Bit Single-Core32-Bit32-Bit Single-Core32-Bit
RAM Size144K x 896K x 880K x 8144K x 8
RoHSYesYesYesYes
Lifecycle StatusActiveActiveActiveActive
ConnectivityFlexcomm, I²C, MMC/SD/SDIO, SPI, UART/USART, USBFlexcomm, I²C, SPI, UART/USART, USBCANbus, Flex COMM, I²C, SPI, UART/USARTFlexcomm, I²C, MMC/SD/SDIO, SPI, UART/USART, USB
Data ConvertersA/D 10x16bA/D 10x16b SARA/D 9x16b SARA/D 10x16b SAR
Number of I/O36364536
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