NXP Semiconductors LPC55S06JHI48J Microcontroller, Microprocessor, FPGA Modules
HIGH EFFICIENT ARM CORTEX-M33-BA
Same model may have multiple batches, images only for reference.
Manufacturer
Part Number (MPN)
LPC55S06JHI48J
Detailed Description
Package
48-VFQFN Exposed Pad
Key Features
Package / Case: 48-VFQFN Exposed Pad; Mounting Type: Surface Mount, Wettable Flank
Lifecycle Status
Active
RoHS State
Compliant
Datasheet
LPC55S06JHI48J Datasheet
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Technical Specifications
NXP Semiconductors LPC55S06JHI48J Microcontroller, Microprocessor, FPGA Modules technical specifications.
General
Package / Case
48-VFQFN Exposed Pad
Peripherals
Brown-out Detect/Reset, DMA, I²S, POR, PWM, RNG, WDT
Speed
96MHz
Connectivity
CANBus, Flexcomm, I²C, SPI, UART/USART
Series
LPC550x
Mounting Type
Surface Mount, Wettable Flank
Operating Temperature
-40°C ~ 105°C (TA)
Core Processor
ARM® Cortex®-M33
RAM Size
96K x 8
Numberof IO
30
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