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NXP Semiconductors LPC5534JBD100E Microcontroller, Microprocessor, FPGA Modules

IC MCU M33 128KB/80KB HLQFP100

3,498 ActiveNXP Semiconductors100-LQFPRoHS
LPC5534JBD100E 100-LQFP package illustration

Same model may have multiple batches, images only for reference.

LPC5534JBD100E
Manufacturer
Part Number (MPN)
LPC5534JBD100E
Detailed Description
IC MCU M33 128KB/80KB HLQFP100
Package
100-LQFP
Key Features
Package / Case: 100-LQFP; Mounting Type: Surface Mount
Lifecycle Status
Active
RoHS State
RoHS Compliant
Datasheet
PDF LPC5534JBD100E Datasheet
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Technical Specifications

NXP Semiconductors LPC5534JBD100E Microcontroller, Microprocessor, FPGA Modules technical specifications.

General

RAM Size
96K x 8
RoHS
Yes
Package / Case
100-LQFP
Mounting Type
Surface Mount
Operating Temperature
-40°C ~ 105°C (TA)
Supply Voltage
1.8V ~ 3.6V
Lifecycle Status
Active
Peripherals
DMA, PWM, WDT
Number of I/O
66
Speed
150MHz

Alternate Parts Comparison (LPC5534JBD100E vs LPC54016JBD100E vs DSP56857BUE vs S9S12G192F0VLL)

Side-by-side technical parameter comparison of related primary models in this product family.

This PartAlternate PartsAlternate PartsAlternate Parts
Package / Case100-LQFP100-LQFP100-LQFP100-LQFP
Mounting TypeSurface MountSurface MountSurface MountSurface Mount
Operating Temperature-40°C ~ 105°C (TA)-40°C ~ 105°C (TA)-40°C ~ 85°C (TA)-40°C ~ 105°C (TA)
Supply Voltage1.8V ~ 3.6V1.71V ~ 3.6V1.62V ~ 1.98V3.13V ~ 5.5V
Core ProcessorARM® Cortex®-M33ARM® Cortex®-M456800E12V1
Core Size32-Bit Single-Core32-Bit Single-Core16-Bit16-Bit
RAM Size96K x 8360K x 824K x 1611K x 8
Lifecycle StatusActiveActiveObsoleteActive
ConnectivityCANbus, Flexcomm, I²C, I²S, I³C, SPI, UART/USART, USB2.0CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SmartCard, SPI, SPIFI, UART/USART, USBSCI, SPI, SSICANbus, IrDA, LINbus, SCI, SPI
Number of I/O66644786
Oscillator TypeInternalInternalExternalInternal
PeripheralsDMA, PWM, WDTBrown-out Detect/Reset, DMA, I²S, POR, PWM, WDTDMA, POR, WDTLVD, POR, PWM, WDT
Action

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