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NXP Semiconductors LPC2132FHN64,557 Microcontroller, Microprocessor, FPGA Modules

IC MCU 16/32B 64KB FLASH 64HVQFN

1,979NXP Semiconductors64-VFQFN Exposed PadRoHS
LPC2132FHN64,557 64-VFQFN Exposed Pad package illustration

Same model may have multiple batches, images only for reference.

LPC2132FHN64,557
Manufacturer
Part Number (MPN)
LPC2132FHN64,557
Detailed Description
IC MCU 16/32B 64KB FLASH 64HVQFN
Package
64-VFQFN Exposed Pad
Key Features
Package / Case: 64-VFQFN Exposed Pad; Mounting Type: Surface Mount
Lifecycle Status
Obsolete
RoHS State
RoHS Compliant
Datasheet
PDF LPC2132FHN64,557 Datasheet
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Technical Specifications

NXP Semiconductors LPC2132FHN64,557 Microcontroller, Microprocessor, FPGA Modules technical specifications.

General

Series
LPC2100
RAM Size
16K x 8
RoHS
Yes
Package / Case
64-VFQFN Exposed Pad
Mounting Type
Surface Mount
Operating Temperature
-40°C ~ 85°C (TA)
Supply Voltage
3V ~ 3.6V
Lifecycle Status
Obsolete
Peripherals
Brown-out Detect/Reset, POR, PWM, WDT
Number of I/O
47

Alternate Parts Comparison (LPC2132FHN64,557 vs LPC11C24FBD48/301 vs LPC812M101JDH20FP vs LPC2292FBD144/01,5)

Side-by-side technical parameter comparison of related primary models in this product family.

This PartAlternate PartsAlternate PartsAlternate Parts
Mounting TypeSurface MountSurface MountSurface MountSurface Mount
Operating Temperature-40°C ~ 85°C (TA)-40 °C ~ 85 °C-40°C ~ 105°C (TA)-40°C ~ 85°C (TA)
Supply Voltage3V ~ 3.6V3.3 V3.3 V1.8 V
RAM Size16K x 88 kB4 kB16 kB
RoHSYesCompliantCompliantCompliant
Lifecycle StatusObsoleteProductionProductionNot For New Designs
PackageSOT804-2LFQFPTSSOPLFQFP
PeripheralsBrown-out Detect/Reset, POR, PWM, WDTPOR, WDTBrown-out Detect/Reset, POR, PWM, WDTI2C, PWM
Package / Case64-VFQFN Exposed Pad--20-TSSOP144-LQFP
Core ProcessorARM7®--ARM® Cortex®-M0+ARM7®
Core Size16/32-Bit--32-Bit Single-Core16/32-Bit
ConnectivityI²C, Microwire, SPI, SSI, SSP, UART/USART--I²C, SPI, UART/USARTCANbus, EBI/EMI, I²C, Microwire, SPI, SSI, SSP, UART/USART
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