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NXP Semiconductors LPC2106FHN48,551 Microcontroller, Microprocessor, FPGA Modules

IC MCU 16/32B 128KB FLSH 48HVQFN

1,775NXP Semiconductors48-VFQFN Exposed PadRoHS
LPC2106FHN48,551 - No Image Available

Same model may have multiple batches, images only for reference.

LPC2106FHN48,551
Manufacturer
Part Number (MPN)
LPC2106FHN48,551
Detailed Description
Package
48-VFQFN Exposed Pad
Key Features
Package / Case: 48-VFQFN Exposed Pad; Mounting Type: Surface Mount
Lifecycle Status
Obsolete
RoHS State
Compliant
Datasheet
PDF LPC2106FHN48,551 Datasheet
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Technical Specifications

NXP Semiconductors LPC2106FHN48,551 Microcontroller, Microprocessor, FPGA Modules technical specifications.

General

Operating Temperature
-40°C ~ 85°C (TA)
Mounting Type
Surface Mount
Package / Case
48-VFQFN Exposed Pad
Supplier Device Package
48-HVQFN (7x7)
Peripherals
POR, PWM, WDT
Number of I/O
32
Speed
60MHz
Core Processor
ARM7®
RAM Size
64K x 8
Program Memory Type
Flash

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