NXP Semiconductors LPC18S30FBD144E Microcontroller, Microprocessor, FPGA Modules
IC MCU 32BIT ROMLESS 144LQFP
Same model may have multiple batches, images only for reference.
Manufacturer
Part Number (MPN)
LPC18S30FBD144E
Detailed Description
Package
144-LQFP
Key Features
Package / Case: 144-LQFP; Mounting Type: Surface Mount
Lifecycle Status
Active
RoHS State
Compliant
Datasheet
LPC18S30FBD144E Datasheet
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Technical Specifications
NXP Semiconductors LPC18S30FBD144E Microcontroller, Microprocessor, FPGA Modules technical specifications.
General
Operating Temperature
-40°C ~ 85°C (TA)
Mounting Type
Surface Mount
Package / Case
144-LQFP
Supplier Device Package
144-LQFP (20x20)
Peripherals
Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT
Number of I/O
83
Speed
180MHz
Core Processor
ARM® Cortex®-M3
RAM Size
200K x 8
Program Memory Type
ROMless
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