NXP Semiconductors LPC11U35FHN33/401, Microcontroller, Microprocessor, FPGA Modules
IC MCU 32BIT 64KB FLASH 32HVQFN
Same model may have multiple batches, images only for reference.
Manufacturer
Part Number (MPN)
LPC11U35FHN33/401,
Detailed Description
Package
32-VQFN Exposed Pad
Key Features
Package / Case: 32-VQFN Exposed Pad; Mounting Type: Surface Mount
Lifecycle Status
Active
RoHS State
Compliant
Datasheet
LPC11U35FHN33/401, Datasheet
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Technical Specifications
NXP Semiconductors LPC11U35FHN33/401, Microcontroller, Microprocessor, FPGA Modules technical specifications.
General
Operating Temperature
-40°C ~ 85°C (TA)
Mounting Type
Surface Mount
Package / Case
32-VQFN Exposed Pad
Supplier Device Package
32-HVQFN (7x7)
Peripherals
Brown-out Detect/Reset, POR, WDT
Number of I/O
26
Speed
50MHz
EEPROM Size
4K x 8
Core Processor
ARM® Cortex®-M0
RAM Size
10K x 8
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