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NXP Semiconductors LPC11E37FHI33/501E Microcontroller, Microprocessor, FPGA Modules

IC MCU 32BIT 128KB FLASH 64LQFP

5,964NXP SemiconductorsLPC11Exx64-LQFPRoHS
LPC11E37FHI33/501E - No Image Available

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LPC11E37FHI33/501E
Manufacturer
Part Number (MPN)
LPC11E37FHI33/501E
Series
Detailed Description
IC MCU 32BIT 128KB FLASH 64LQFP
Package
64-LQFP
Key Features
Package / Case: 64-LQFP; Mounting Type: Surface Mount
Lifecycle Status
Obsolete
RoHS State
RoHS Compliant
Datasheet
PDF LPC11E37FHI33/501E Datasheet
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Technical Specifications

NXP Semiconductors LPC11E37FHI33/501E Microcontroller, Microprocessor, FPGA Modules technical specifications.

General

RAM Size
12K x 8
Package / Case
64-LQFP
Mounting Type
Surface Mount
Operating Temperature
-40°C ~ 85°C (TA)
Supply Voltage
1.8V ~ 3.6V
Peripherals
Brown-out Detect/Reset, POR, WDT
Number of I/O
28
Speed
50MHz
EEPROM Size
4K x 8
Core Processor
ARM® Cortex®-M0

Alternate Parts Comparison (LPC11E37FHI33/501E vs LPC11E37FBD48/501Y vs LPC11E67JBD48E vs LPC11E68JBD48E)

Side-by-side technical parameter comparison of related primary models in this product family.

This PartAlternate PartsAlternate PartsAlternate Parts
Package / Case64-LQFP48-LQFP48-LQFP48-LQFP
Mounting TypeSurface MountSurface MountSurface MountSurface Mount
Operating Temperature-40°C ~ 85°C (TA)-40°C ~ 85°C (TA)-40°C ~ 105°C (TA)-40°C ~ 105°C (TA)
Supply Voltage1.8V ~ 3.6V1.8V ~ 3.6V2.4V ~ 3.6V2.4V ~ 3.6V
Core ProcessorARM® Cortex®-M0ARM® Cortex®-M0ARM® Cortex®-M0+ARM® Cortex®-M0+
Core Size32-Bit Single-Core32-Bit Single-Core32-Bit Single-Core32-Bit Single-Core
RAM Size12K x 812K x 820K x 836K x 8
ConnectivityI²C, Microwire, SmartCard, SPI, SSP, UART/USARTI²C, Microwire, SmartCard, SPI, SSP, UART/USARTI²C, Microwire, SPI, SSI, SSP, UART/USARTI²C, Microwire, SPI, SSI, SSP, UART/USART
Data ConvertersA/D 8x10bA/D 8x10bA/D 8x12bA/D 8x12b
EEPROM Size4K x 84K x 84K x 84K x 8
Number of I/O28403636
Oscillator TypeInternalInternalInternalInternal
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