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NXP Semiconductors 88MW322-A0-NXUE/AZ System On Chip (SoC)

LOW-POWER WLAN MICROCONTROLLER S

11,964 ActiveNXP Semiconductors88-VFQFN Exposed PadRoHS
88MW322-A0-NXUE/AZ 88-VFQFN Exposed Pad package illustration

Same model may have multiple batches, images only for reference.

88MW322-A0-NXUE/AZ
Manufacturer
Part Number (MPN)
88MW322-A0-NXUE/AZ
Detailed Description
LOW-POWER WLAN MICROCONTROLLER S
Package
88-VFQFN Exposed Pad
Lifecycle Status
Active
RoHS State
RoHS Compliant
Datasheet
PDF 88MW322-A0-NXUE/AZ Datasheet
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Technical Specifications

NXP Semiconductors 88MW322-A0-NXUE/AZ System On Chip (SoC) technical specifications.

General

Protocol
802.11n/g/b, Bluetooth
Memory Size
512kB RAM, 128kB ROM
RoHS
Yes
Package / Case
88-VFQFN Exposed Pad
Mounting Type
Surface Mount
Operating Temperature
-30°C ~ 85°C (TA)
Supply Voltage
4.4V ~ 5.25V
Lifecycle Status
Active
Frequency
2.4GHz
Type
TxRx + MCU

Related Parts Comparison (88MW322-A0-NXUE/AZ vs A2F500M3G-CSG288 vs A2F200M3F-1FGG484 vs A2F500M3G-1PQG208I)

Side-by-side specifications of related catalog parts.

Engineering verification required. Related parts may have different electrical ratings, pinouts, footprints, and operating limits. Verify suitability for your circuit before substitution.

This PartRelated PartRelated PartRelated Part
Package / Case88-VFQFN Exposed Pad288-TFBGA, CSPBGA484-BGA208-BFQFP
Operating Temperature-30°C ~ 85°C (TA)0°C ~ 85°C (TJ)0°C ~ 85°C (TJ)-40°C ~ 100°C (TJ)
RoHSYesYesYesYes
Lifecycle StatusActiveActiveActiveActive
PackageSOT2124-1288-TFBGA,CSPBGAFBGA-484208-BFQFP
Series--SmartFusion®SmartFusion®SmartFusion®
Flash Size--512KB256kB512KB
Core Processor--ARM® Cortex®-M3ARM® Cortex®-M3ARM® Cortex®-M3
RAM Size--64kB64kB64kB
Architecture--MCU, FPGAMCU, FPGAMCU, FPGA
Connectivity--EBI/EMI, Ethernet, I²C, SPI, UART/USARTEBI/EMI, Ethernet, I²C, SPI, UART/USARTEthernet, I²C, SPI, UART/USART
Number of I/O--MCU - 31, FPGA - 78MCU - 41, FPGA - 94MCU - 22, FPGA - 66
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