NXP Semiconductors 74LVC1G3157GW Microcontrollers
IC MUX/DEMUX 2X1 6TSSOP / Analog Multiplexer Single 2:1 6-Pin TSSOP
Same model may have multiple batches, images only for reference.
Manufacturer
Part Number (MPN)
74LVC1G3157GW
Detailed Description
IC MUX/DEMUX 2X1 6TSSOP / Analog Multiplexer Single 2:1 6-Pin TSSOP
Package
Reel - TR
Lifecycle Status
Active
Datasheet
74LVC1G3157GW Datasheet
Quick Jump:
Technical Specifications
NXP Semiconductors 74LVC1G3157GW Microcontrollers technical specifications.
General
RoHS
Compliant
Number of Pins
6
Number of Channels
2
Package / Case
Reel - TR
Mounting Type
Surface Mount
Operating Temperature
-40 °C ~ 125 °C
Supply Voltage
3.3 V
Lifecycle Status
Active
3db Bandwidth
300 MHz
Ambient Temperature Range High
125 °C
Related Parts Comparison (74LVC1G3157GW vs S9S08DZ60F2MLF vs MC705P6ACDWE vs MKL03Z32VFK4)
Side-by-side specifications of related catalog parts.
Engineering verification required. Related parts may have different electrical ratings, pinouts, footprints, and operating limits. Verify suitability for your circuit before substitution.
| This Part | Related Part | Related Part | Related Part | |
|---|---|---|---|---|
| Mounting Type | Surface Mount | Surface Mount | Surface Mount | Surface Mount |
| Operating Temperature | -40 °C ~ 125 °C | -40°C ~ 125°C (TA) | -40°C ~ 85°C (TA) | -40 °C ~ 105 °C |
| Supply Voltage | 3.3 V | 3 V | 5 V | 3.3 V |
| Number of Pins | 6 | 48 | 28 | 24 |
| RoHS | Compliant | Compliant | Compliant | Compliant |
| Lifecycle Status | Active | Production | Not For New Designs | Production |
| Introduction Date | January 14, 2005 | 2016-07-20 | 2015-07-23 | 2014-07-07 |
| Package | Reel - TR | LFQFP | SOP | QFN |
| Package / Case | Reel - TR | 48-LQFP | 28-SOIC | -- |
| Memory Size | -- | 60 kB | 4.6 kB | 32 kB |
| Interface | -- | CAN, SPI | SPI | I2C, SPI |
| Data Bus Width | -- | 8 b | 8 b | 32 b |
| Action |
Cross Reference
Manufacturer-stated alternates from official cross-reference tools. These are not a guaranteed pin-compatible drop-in. Qualify package, pinout, and electrical limits against the datasheet before a board change. See cross-reference vs drop-in compatible .
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