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Micron Technology Inc. NAND256R3A2BZA6E Flash Memory

Flash Memory IC 256Mb (32M x 8) Parallel 1.7V ~ 1.95V 55-VFBGA (8x10)

2,500Micron Technology Inc.55-VFBGA (8x10)$64.51
NAND256R3A2BZA6E 55-VFBGA (8x10) package illustration

Same model may have multiple batches, images only for reference.

NAND256R3A2BZA6E
Part Number (MPN)
NAND256R3A2BZA6E
Detailed Description
IC FLASH 256M PARALLEL 55VFBGA / 128 Mbit, 256 Mbit, 512 Mbit, 1 Gbit (x8/x16) 528 Byte/264 Word Page, 1.8V/3V, NAND Flash Memories
Package
55-VFBGA (8x10)
Lifecycle Status
Obsolete
Datasheet
PDF NAND256R3A2BZA6E Datasheet
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Technical Specifications

Micron Technology Inc. NAND256R3A2BZA6E Flash Memory technical specifications.

General

Memory Size
256Mb (32M x 8)
Package / Case
55-TFBGA
Packaging
Tray
Mounting Type
Surface Mount
Operating Temperature
-40°C ~ 85°C (TA)
Supply Voltage
1.7V ~ 1.95V
Lifecycle Status
Obsolete
MSL Level
3 (168 Hours)
Memory Interface
Parallel
Manufacturer Package
55-TFBGA

Related Parts Comparison (NAND256R3A2BZA6E vs NAND01GW3B2BN6E vs NAND512R3A2SZA6E vs NAND256W3A2BN6E)

Side-by-side specifications of related catalog parts.

Engineering verification required. Related parts may have different electrical ratings, pinouts, footprints, and operating limits. Verify suitability for your circuit before substitution.

This PartRelated PartRelated PartRelated Part
Mounting TypeSurface MountSurface MountSurface MountSurface Mount
Operating Temperature-40°C ~ 85°C (TA)-40 ~ 85-40°C ~ 85°C (TA)-40°C ~ 85°C (TA)
Supply Voltage1.7V ~ 1.95V3/3.31.7V ~ 1.95V2.7V ~ 3.6V
Memory Size256Mb (32M x 8)1G512 Mbit256 Mbit
Lifecycle StatusObsoleteObsoleteObsoleteObsolete
Package / Case55-TFBGA--63-TFBGA48-TFSOP
Access Time50ns--50 ns50 ns
Memory FormatFLASH--FLASHFLASH
Memory InterfaceParallel--ParallelParallel
Memory Organization32M x 8--64M x 832M x 8
Memory TypeNon-Volatile--Non-VolatileNon-Volatile
TechnologyFLASH - NAND--FLASH - NANDFLASH - NAND
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