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Micron Technology Inc. MT61K512M32KPA-16:B DRAM

DRAM Memory IC 16Gbit Parallel 8 GHz 1.31V ~ 1.391V 180-FBGA (12x14)

In Stock ActiveMicron Technology Inc.180-FBGA (12x14)RoHS
MT61K512M32KPA-16:B - No Image Available

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MT61K512M32KPA-16:B
Part Number (MPN)
MT61K512M32KPA-16:B
Detailed Description
IC DRAM 16GBIT PAR 8GHZ 180FBGA
Package
180-FBGA (12x14)
Lifecycle Status
Active
RoHS State
RoHS Compliant
Datasheet
PDF MT61K512M32KPA-16:B Datasheet
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Technical Specifications

Micron Technology Inc. MT61K512M32KPA-16:B DRAM technical specifications.

General

Memory Size
16Gbit
RoHS
ROHS3 Compliant
Number of Pins
180
Package / Case
180-TFBGA
Packaging
Tray
Mounting Type
Surface Mount
Operating Temperature
0°C ~ 95°C (TC)
Supply Voltage
1.31V ~ 1.391V
Lifecycle Status
Active
Fbga Marking Code
D9XBC

Alternate Parts Comparison (MT61K512M32KPA-16:B vs MT61K512M32KPA-18:E vs MT61K512M32KPA-14:C vs MT61K512M32KPA-16:C)

Side-by-side technical parameter comparison of related primary models in this product family.

This PartAlternate PartsAlternate PartsAlternate Parts
Manufacturer--------
Package / Case180-TFBGA180-TFBGA180-TFBGA180-TFBGA
Mounting TypeSurface MountSurface MountSurface MountSurface Mount
Operating Temperature0°C ~ 95°C (TC)0°C ~ 95°C (TC)0°C ~ 95°C (TC)0°C ~ 95°C (TC)
Supply Voltage1.31V ~ 1.391V1.3095V ~ 1.391V1.3095V ~ 1.3905V1.3095V ~ 1.3905V
Memory Size16Gbit16Gbit16Gbit16Gbit
Lifecycle StatusActiveActiveActiveActive
Fbga Marking CodeD9XBCD8DZKD9ZPMD9ZPP
Max Frequency8 GHz9 GHz7 GHz8 GHz
Memory FormatDRAMDRAMDRAMDRAM
Memory InterfaceParallelPOD_135POD_135POD_135
Memory Organization512M x 32512M x 32512M x 32512M x 32
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