Micron Technology Inc. MT53E512M32D1ZW-046BWT:B DRAM
LPDDR4 16GBIT 32 200/264 TFBGA 1
Same model may have multiple batches, images only for reference.
Manufacturer
Part Number (MPN)
MT53E512M32D1ZW-046BWT:B
Detailed Description
Package
200-TFBGA (10x14.5)
Key Features
Package: BGA; Package / Case: 200-TFBGA; Mounting Type: Surface Mount; Memory Size: 16G; Interface: LVSTL
Lifecycle Status
Active
RoHS State
Compliant
Datasheet
MT53E512M32D1ZW-046BWT:B Datasheet
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Technical Specifications
Micron Technology Inc. MT53E512M32D1ZW-046BWT:B DRAM technical specifications.
General
Fbga Marking Code
D8FLP
Organization
512Mx32
HTS
EA
ECCN
EAR99
Ppap
No
Data Bus Width Bit
32
Operating Current Ma
400
Number of Internal Banks
8
Lifecycle Status
Active
Supplier Device Package
200-TFBGA (10x14.5)
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MT53E512M32D1ZW-046BIT:BMicron Technology Inc.Package: BGA | Package / Case: 200-TFBGA | Mounting Type: Surface Mount | Memory Size: 16G | Number of Pins: 200 | Organization: 512Mx32
MT53E512M32D1ZW-046BAIT:BMicron Technology Inc.Package: Tray | Package / Case: 200-TFBGA | Mounting Type: Surface Mount | Supply Voltage: 1.06V ~ 1.17V | Memory Size: 16Gbit | Operating Temperature: -40°C ~ 95°C (TC) | Organization: 512 M x 32
MT53E512M32D1ZW-046BAUT:BMicron Technology Inc.Package: Tray | Package / Case: 200-TFBGA | Mounting Type: Surface Mount | Supply Voltage: 1.06V ~ 1.17V | Memory Size: 16Gbit | Operating Temperature: -40°C ~ 125°C (TC) | Organization: 512 M x 32