Micron Technology Inc. MT53E512M32D1ZW-046BAIT:B DRAM
IC DRAM 16GBIT 2.133GHZ 200WFBGA
Same model may have multiple batches, images only for reference.
Manufacturer
Part Number (MPN)
MT53E512M32D1ZW-046BAIT:B
Detailed Description
Package
200-TFBGA (10x14.5)
Key Features
Package: Tray; Package / Case: 200-TFBGA; Mounting Type: Surface Mount; Supply Voltage: 1.06V ~ 1.17V; Memory Size: 16Gbit
Lifecycle Status
Active
RoHS State
Compliant
Datasheet
MT53E512M32D1ZW-046BAIT:B Datasheet
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Technical Specifications
Micron Technology Inc. MT53E512M32D1ZW-046BAIT:B DRAM technical specifications.
General
Fbga Marking Code
D8FLX
Max Frequency
2.133 GHz
HTS
EA
ECCN
EAR99
Data Bus Width Bit
32
Memory Type
Volatile
Lifecycle Status
Active
Supplier Device Package
200-TFBGA (10x14.5)
Max Operating Temp
95
Access Time
3.5 ns
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MT53E512M32D1ZW-046BIT:BMicron Technology Inc.Package: BGA | Package / Case: 200-TFBGA | Mounting Type: Surface Mount | Memory Size: 16G | Number of Pins: 200 | Organization: 512Mx32
MT53E512M32D1ZW-046BWT:BMicron Technology Inc.Package: BGA | Package / Case: 200-TFBGA | Mounting Type: Surface Mount | Memory Size: 16G | Interface: LVSTL | Number of Pins: 200 | Organization: 512Mx32
MT53E512M32D1ZW-046BAUT:BMicron Technology Inc.Package: Tray | Package / Case: 200-TFBGA | Mounting Type: Surface Mount | Supply Voltage: 1.06V ~ 1.17V | Memory Size: 16Gbit | Operating Temperature: -40°C ~ 125°C (TC) | Organization: 512 M x 32