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Micron Technology Inc. MT52L256M32D1V01MWC1 DRAM

LPDDR3 8G DIE 256MX32

In StockMicron Technology Inc.DieRoHS
MT52L256M32D1V01MWC1 Die package illustration

Same model may have multiple batches, images only for reference.

MT52L256M32D1V01MWC1
Part Number (MPN)
MT52L256M32D1V01MWC1
Detailed Description
LPDDR3 8G DIE 256MX32
Package
Die
Lifecycle Status
Obsolete
RoHS State
RoHS Compliant
Datasheet
PDF MT52L256M32D1V01MWC1 Datasheet
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Technical Specifications

Micron Technology Inc. MT52L256M32D1V01MWC1 DRAM technical specifications.

General

Series
MT52L
Memory Size
8 Gbit
Data Bus Width
32 bit
RoHS
Compliant
Lifecycle Status
Obsolete
PPAP
No
Automotive
No
Type
SDRAM Mobile - LPDDR3
Organization
256 M x 32
Package
Die

Alternate Parts Comparison (MT52L256M32D1V01MWC1 vs MT25QU512ABB8E12-0AAT vs MT28FW02GBBA1HPC-0AAT vs MT28FW02GBBA1LPC-0AAT)

Side-by-side technical parameter comparison of related primary models in this product family.

This PartAlternate PartsAlternate PartsAlternate Parts
SeriesMT52LMT25QUMT28FWMT28FW
Memory Size8 Gbit512Mb (64M x 8)2G2G
Data Bus Width32 bit4 bit16 bit16 bit
RoHSCompliantCompliantCompliantCompliant
Lifecycle StatusObsoleteActiveActiveActive
AutomotiveNoYesYesYes
Organization256 M x 32128 M x 4128 M x 16128 M x 16
PackageDie24-TBGABGABGA
Package / Case--24-TBGA64-LBGA64-LBGA
Mounting Type--Surface MountSurface MountSurface Mount
Operating Temperature---40°C ~ 105°C (TA)-40°C ~ 105°C (TA)-40°C ~ 105°C (TA)
Supply Voltage--1.7V ~ 2V1.7V ~ 3.6V1.7V ~ 3.6V
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