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Micron Technology Inc. MT47H32M16CC-3E:B DRAM

DRAM Memory IC 512Mbit Parallel 333 MHz 1.7V ~ 1.9V 84-FBGA (12x12.5)

In StockMicron Technology Inc.84-FBGA (12x12.5)RoHS
MT47H32M16CC-3E:B 84-FBGA (12x12.5) package illustration

Same model may have multiple batches, images only for reference.

MT47H32M16CC-3E:B
Part Number (MPN)
MT47H32M16CC-3E:B
Detailed Description
IC DRAM 512MBIT PARALLEL 84FBGA
Package
84-FBGA (12x12.5)
Lifecycle Status
Obsolete
RoHS State
RoHS Compliant
Datasheet
PDF MT47H32M16CC-3E:B Datasheet
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Technical Specifications

Micron Technology Inc. MT47H32M16CC-3E:B DRAM technical specifications.

General

Memory Size
512 Mbit
RoHS
ROHS3 Compliant
Package / Case
84-TFBGA
Packaging
Tray
Mounting Type
Surface Mount
Operating Temperature
0°C ~ 85°C (TC)
Supply Voltage
1.7V ~ 1.9V
Lifecycle Status
Obsolete
Fbga Marking Code
D9DPH
Max Frequency
333 MHz

Related Parts Comparison (MT47H32M16CC-3E:B vs MT25QU512ABB8E12-0AAT vs MT28FW02GBBA1HPC-0AAT vs MT28EW512ABA1HPC-0SIT)

Side-by-side specifications of related catalog parts.

Engineering verification required. Related parts may have different electrical ratings, pinouts, footprints, and operating limits. Verify suitability for your circuit before substitution.

This PartRelated PartRelated PartRelated Part
Package / Case84-TFBGA24-TBGA64-LBGA64-LBGA
Mounting TypeSurface MountSurface MountSurface MountSurface Mount
Operating Temperature0°C ~ 85°C (TC)-40°C ~ 105°C (TA)-40°C ~ 105°C (TA)-40°C ~ 85°C (TA)
Supply Voltage1.7V ~ 1.9V1.7V ~ 2V1.7V ~ 3.6V2.7V ~ 3.6V
Memory Size512 Mbit512Mb (64M x 8)2G512M
RoHSROHS3 CompliantCompliantCompliantCompliant
Lifecycle StatusObsoleteActiveActiveActive
Fbga Marking CodeD9DPHRW231RB175RB143
Memory FormatDRAMFlashFLASHFLASH
Memory InterfaceParallelSPIParallelParallel
Memory Organization32M x 1664M x 8128M x 1664M x 8, 32M x 16
Memory TypeVolatileNon-VolatileNon-VolatileNon-Volatile
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