Micron Technology Inc. MT47H32M16BN-25ED DRAM
DRAM Chip DDR2 SDRAM 512Mbit 32Mx16 1.8V 84-Pin FBGA Tray
Same model may have multiple batches, images only for reference.
Manufacturer
Part Number (MPN)
MT47H32M16BN-25ED
Detailed Description
Package
FBGA
Key Features
Package: BGA; Mounting Type: Surface Mount; Supply Voltage: 1.8; Memory Size: 512M; Interface: SSTL_18
Lifecycle Status
Obsolete
RoHS State
Compliant
Datasheet
MT47H32M16BN-25ED Datasheet
Quick Jump:
Technical Specifications
Micron Technology Inc. MT47H32M16BN-25ED DRAM technical specifications.
General
Organization
32Mx16
ECCN
EAR99
Ppap
No
Data Bus Width Bit
16
Operating Current Ma
295
Number of Internal Banks
4
Automotive
No
Address Bus Width Bit
15
Min Operating Temp
0
Max Operating Temp
85
More in This Category
Browse related parts from the same category — sorted by series, manufacturer, and package similarity. These are not verified pin-to-pin substitutes.
MT41K128M16JT-125:KMicron Technology Inc.Package: BGA | Package / Case: 96-TFBGA | Mounting Type: Surface Mount | Supply Voltage: 1.283V ~ 1.45V | Memory Size: 2G | Operating Temperature: 0°C ~ 95°C (TC) | Number of Pins: 96 | Organization: 128Mx16
MT41K64M16TW-107:JMicron Technology Inc.Package: BGA | Package / Case: 96-TFBGA | Mounting Type: Surface Mount | Supply Voltage: 1.283V ~ 1.45V | Memory Size: 1G | Operating Temperature: 0°C ~ 95°C (TC) | Number of Pins: 96 | Organization: 64Mx16
MT41K128M16JT-107:KMicron Technology Inc.Package: BGA | Package / Case: 96-TFBGA | Mounting Type: Surface Mount | Supply Voltage: 1.283V ~ 1.45V | Memory Size: 2G | Operating Temperature: 0°C ~ 95°C (TC) | Number of Pins: 96 | Organization: 128Mx16
EDB1332BDBH-1DAAT-F-RMicron Technology Inc.Package: FBGA | Mounting Type: Surface Mount | Supply Voltage: 1.2 V | Interface: Parallel | Number of Pins: 134