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Micron Technology Inc. MT40A2G4WE-075E:D DRAM

DRAM Memory IC 8Gbit Parallel 1.33 GHz 1.14V ~ 1.26V 78-FBGA (8x12)

In StockMicron Technology Inc.78-FBGA (8x12)RoHS
MT40A2G4WE-075E:D 78-FBGA (8x12) package illustration

Same model may have multiple batches, images only for reference.

MT40A2G4WE-075E:D
Part Number (MPN)
MT40A2G4WE-075E:D
Detailed Description
IC DRAM 8GBIT PARALLEL 78FBGA
Package
78-FBGA (8x12)
Lifecycle Status
Obsolete
RoHS State
RoHS Compliant
Datasheet
PDF MT40A2G4WE-075E:D Datasheet
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Technical Specifications

Micron Technology Inc. MT40A2G4WE-075E:D DRAM technical specifications.

General

Memory Size
8Gbit
RoHS
ROHS3 Compliant
Package / Case
78-TFBGA
Packaging
Tray
Mounting Type
Surface Mount
Operating Temperature
0°C ~ 95°C (TC)
Supply Voltage
1.14V ~ 1.26V
Lifecycle Status
Obsolete
Fbga Marking Code
D9TZX
Max Frequency
1.33 GHz

Related Parts Comparison (MT40A2G4WE-075E:D vs MT28FW02GBBA1HPC-0AAT vs MT28EW512ABA1HPC-0SIT vs MT25QU512ABB8E12-0AAT)

Side-by-side specifications of related catalog parts.

Engineering verification required. Related parts may have different electrical ratings, pinouts, footprints, and operating limits. Verify suitability for your circuit before substitution.

This PartRelated PartRelated PartRelated Part
Package / Case78-TFBGA64-LBGA64-LBGA24-TBGA
Mounting TypeSurface MountSurface MountSurface MountSurface Mount
Operating Temperature0°C ~ 95°C (TC)-40°C ~ 105°C (TA)-40°C ~ 85°C (TA)-40°C ~ 105°C (TA)
Supply Voltage1.14V ~ 1.26V1.7V ~ 3.6V2.7V ~ 3.6V1.7V ~ 2V
Memory Size8Gbit2G512M512Mb (64M x 8)
RoHSROHS3 CompliantCompliantCompliantCompliant
Lifecycle StatusObsoleteActiveActiveActive
Fbga Marking CodeD9TZXRB175RB143RW231
Memory FormatDRAMFLASHFLASHFlash
Memory InterfaceParallelParallelParallelSPI
Memory Organization2G x 4128M x 1664M x 8, 32M x 1664M x 8
Memory TypeVolatileNon-VolatileNon-VolatileNon-Volatile
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