Micron Technology Inc. MT38Q50DEB10DBDXAU.Y74 DRAM
IC MEM DDR MULTICHIP
Same model may have multiple batches, images only for reference.
Manufacturer
Part Number (MPN)
MT38Q50DEB10DBDXAU.Y74
Detailed Description
IC MEM DDR MULTICHIP
Package
Tray
Key Features
Package: Tray
Lifecycle Status
Active
RoHS State
RoHS Compliant
Datasheet
MT38Q50DEB10DBDXAU.Y74 Datasheet
Quick Jump:
Technical Specifications
Micron Technology Inc. MT38Q50DEB10DBDXAU.Y74 DRAM technical specifications.
General
RoHS
ROHS3 Compliant
Packaging
Tray
Lifecycle Status
Active
Fbga Marking Code
JZ135
Alternate Parts Comparison (MT38Q50DEB10DBDXAU.Y74 vs MT41J128M16HA-15EIT:D vs MT48LC16M16A2P-6A vs MT46H128M32L2KQ-5IT:A)
Side-by-side technical parameter comparison of related primary models in this product family.
| This Part | Alternate Parts | Alternate Parts | Alternate Parts | |
|---|---|---|---|---|
| Lifecycle Status | Active | Obsolete(EOL) | Active | Obsolete(EOL) |
| RoHS | ROHS3 Compliant | Yes | Yes | -- |
| Mounting Type | -- | SMD (SMT) | SMD (SMT) | SMD (SMT) |
| Memory Size | -- | 2Gb (128M x 16) | 256Mb (16M x 16) | 4Gb (128M x 32) |
| Access Time | -- | 13.5ns | 5.4ns | 5.0ns |
| Max Frequency | -- | 667MHz | 167MHz | 200MHz |
| Memory Format | -- | DRAM | DRAM | DRAM |
| Memory Type | -- | Volatile | Volatile | Volatile |
| Supply Voltage Operating | -- | 1.425 V to 1.575 V | 3 V to 3.6 V | 1.7 V to 1.95 V |
| Technology | -- | SDRAM - DDR3 | SDRAM | SDRAM - Mobile LPDDR |
| Temperature Range Operating | -- | -40°C to 95°C (TC) | 0°C to 70°C (TA) | -40°C to 85°C (TA) |
| Action |
More Parts in DRAM
Browse additional parts from the same category, grouped by series, package type, and manufacturer. These are catalog suggestions — not verified pin-compatible alternates.