Micron Technology Inc. MT38L3031AA03JVZZI.X7A SRAM
Multichip Packages, NOR-Based MCP, 128Mb, PSRAM (Sync) 64Mb, 1.8V, 56-ball TFBGA, RoHS
Same model may have multiple batches, images only for reference.
Manufacturer
Part Number (MPN)
MT38L3031AA03JVZZI.X7A
Detailed Description
Multichip Packages, NOR-Based MCP, 128Mb, PSRAM (Sync) 64Mb, 1.8V, 56-ball TFBGA, RoHS
Package
TFBGA
Key Features
Package: TFBGA; Mounting Type: SMD (SMT)
Lifecycle Status
Active
RoHS State
RoHS Compliant
Datasheet
MT38L3031AA03JVZZI.X7A Datasheet
Quick Jump:
Technical Specifications
Micron Technology Inc. MT38L3031AA03JVZZI.X7A SRAM technical specifications.
General
RoHS
Compliant
Mounting Type
SMD (SMT)
Operating Temperature
-40 °C ~ 85 °C
Fbga Marking Code
RC010
Nominal Supply Voltage Dc
1.8 V
Density
64 Mb
Package
TFBGA
Alternate Parts Comparison (MT38L3031AA03JVZZI.X7A vs MT25QU512ABB8E12-0AAT vs MT28FW02GBBA1HPC-0AAT vs MT28EW512ABA1HPC-0SIT)
Side-by-side technical parameter comparison of related primary models in this product family.
| This Part | Alternate Parts | Alternate Parts | Alternate Parts | |
|---|---|---|---|---|
| Mounting Type | SMD (SMT) | Surface Mount | Surface Mount | Surface Mount |
| Operating Temperature | -40 °C ~ 85 °C | -40°C ~ 105°C (TA) | -40°C ~ 105°C (TA) | -40°C ~ 85°C (TA) |
| RoHS | Compliant | Compliant | Compliant | Compliant |
| Fbga Marking Code | RC010 | RW231 | RB175 | RB143 |
| Package | TFBGA | 24-TBGA | BGA | BGA |
| Series | -- | MT25QU | MT28FW | MT28EW |
| Package / Case | -- | 24-TBGA | 64-LBGA | 64-LBGA |
| Supply Voltage | -- | 1.7V ~ 2V | 1.7V ~ 3.6V | 2.7V ~ 3.6V |
| Memory Size | -- | 512Mb (64M x 8) | 2G | 512M |
| Interface | -- | Serial (SPI, Dual SPI, Quad SPI) | Parallel | Parallel |
| Data Bus Width | -- | 4 bit | 16 bit | 8 bit/16 bit |
| Active Read Current Max | -- | 35 mA | 50 mA | 50 mA |
| Action |
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