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Micron Technology Inc. MT29F256G08EBHAFB16A3WC1ES Flash Memory

IC Flash TLC 256G Die 32GX8

In Stock ActiveMicron Technology Inc.DieRoHS
MT29F256G08EBHAFB16A3WC1ES - No Image Available

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MT29F256G08EBHAFB16A3WC1ES
Part Number (MPN)
MT29F256G08EBHAFB16A3WC1ES
Detailed Description
IC Flash TLC 256G Die 32GX8
Package
Die
Lifecycle Status
Active
RoHS State
Supplier Unconfirmed
Datasheet
PDF MT29F256G08EBHAFB16A3WC1ES Datasheet
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Technical Specifications

Micron Technology Inc. MT29F256G08EBHAFB16A3WC1ES Flash Memory technical specifications.

General

Memory Size
256Gb (32G x 8)
RoHS
Supplier Unconfirmed
Package / Case
Die
Mounting Type
Surface Mount
Operating Temperature
0°C ~ 70°C (TA)
Supply Voltage
2.5V ~ 3.6V
Lifecycle Status
Unconfirmed
Technology
FLASH - NAND (TLC)
Memory Type
Non-Volatile
Max Frequency
333 MHz

Alternate Parts Comparison (MT29F256G08EBHAFB16A3WC1ES vs MT29F4G08ABAEAM70M3WC1 vs MT29F64G08CBABAL84A3WC1 vs MT29F4G08ABAFAM70A3WC1)

Side-by-side technical parameter comparison of related primary models in this product family.

This PartAlternate PartsAlternate PartsAlternate Parts
Package / CaseDieDieDieDie
Mounting TypeSurface MountSurface MountSurface MountSurface Mount
Operating Temperature0°C ~ 70°C (TA)0°C ~ 70°C (TA)0°C ~ 70°C (TA)-40°C ~ 105°C (TC)
Supply Voltage2.5V ~ 3.6V2.7V ~ 3.6V2.7V ~ 3.6V2.7V ~ 3.6V
Memory Size256Gb (32G x 8)4Gbit64Gbit4Gbit
Lifecycle StatusUnconfirmedObsoleteObsoleteActive
Memory FormatFlashFLASHFLASHFLASH
Memory InterfaceParallelParallelParallelParallel
Memory TypeNon-VolatileNon-VolatileNon-VolatileNon-Volatile
TechnologyFLASH - NAND (TLC)FLASH - NANDFLASH - NANDFLASH - NAND (SLC)
Memory Organization--512M x 88G x 8512M x 8
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