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Micron Technology Inc. MT29F1T08EBLCHB58R3WC1-K Flash Memory

128GX8 NAND FLASH DIE-COM 2.5V M

In Stock ActiveMicron Technology Inc.BulkRoHS
MT29F1T08EBLCHB58R3WC1-K - No Image Available

Same model may have multiple batches, images only for reference.

MT29F1T08EBLCHB58R3WC1-K
Part Number (MPN)
MT29F1T08EBLCHB58R3WC1-K
Detailed Description
128GX8 NAND FLASH DIE-COM 2.5V M
Package
Bulk
Key Features
Package: Bulk; Package / Case: Die
Lifecycle Status
Active
RoHS State
RoHS Compliant
Datasheet
PDF MT29F1T08EBLCHB58R3WC1-K Datasheet
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Technical Specifications

Micron Technology Inc. MT29F1T08EBLCHB58R3WC1-K Flash Memory technical specifications.

General

Manufacturer
Micron Technology Inc.
RoHS
ROHS3 Compliant
Package / Case
Die
Packaging
Bulk
Mounting Type
SMD/SMT
Lifecycle Status
Active
Moisture Sensitive
Yes
Ushts
8542320051

Alternate Parts Comparison (MT29F1T08EBLCHB58R3WC1-K vs MT29F1G08ABADAH4:D vs MT29F1G01AAADDH4:D vs MT28F800B5WG-8T)

Side-by-side technical parameter comparison of related primary models in this product family.

This PartAlternate PartsAlternate PartsAlternate Parts
Mounting TypeSMD/SMTSMD (SMT)SMD (SMT)SMD (SMT)
Lifecycle StatusActiveActiveActive--
RoHSROHS3 Compliant----Compliant
ManufacturerMicron Technology Inc.------
Package / CaseDie------
Moisture SensitiveYes------
Ushts8542320051------
Memory Size--1Gb (128M x 8)1Gb (1G x 1)--
Estimated Eol Date--Obsolete / End of lifeObsolete / End of life--
Family Name--MT29F1G08ABADAH4MT29F1G01AAADDH4--
Fbga Marking Code--NW301NQ293--
Introduction Date--January 01, 2000January 01, 2000--
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