Micron Technology Inc. EDB8132B4PM-1DAT-F-R DRAM
DRAM Chip Mobile LPDDR2 SDRAM 8Gbit 256Mx32 1.8V/1.2V 168-Pin FBGA
Same model may have multiple batches, images only for reference.
Manufacturer
Part Number (MPN)
EDB8132B4PM-1DAT-F-R
Detailed Description
Package
FBGA
Key Features
Package: BGA; Mounting Type: Surface Mount; Supply Voltage: 1.2/1.8; Memory Size: 8G; Interface: HSUL_12
Lifecycle Status
Obsolete
RoHS State
Compliant
Datasheet
Quick Jump:
Technical Specifications
Micron Technology Inc. EDB8132B4PM-1DAT-F-R DRAM technical specifications.
General
Fbga Marking Code
D9XCM
Organization
256Mx32
HTS
COMPONENTS
ECCN
EAR99
Data Bus Width Bit
32
Operating Current Ma
160
Number of Internal Banks
8
Address Bus Width Bit
17
Min Operating Temp
-40
Max Operating Temp
105
More in This Category
Browse related parts from the same category — sorted by series, manufacturer, and package similarity. These are not verified pin-to-pin substitutes.
MT41K128M16JT-125:KMicron Technology Inc.Package: BGA | Package / Case: 96-TFBGA | Mounting Type: Surface Mount | Supply Voltage: 1.283V ~ 1.45V | Memory Size: 2G | Operating Temperature: 0°C ~ 95°C (TC) | Number of Pins: 96 | Organization: 128Mx16
MT41K64M16TW-107:JMicron Technology Inc.Package: BGA | Package / Case: 96-TFBGA | Mounting Type: Surface Mount | Supply Voltage: 1.283V ~ 1.45V | Memory Size: 1G | Operating Temperature: 0°C ~ 95°C (TC) | Number of Pins: 96 | Organization: 64Mx16
MT41K128M16JT-107:KMicron Technology Inc.Package: BGA | Package / Case: 96-TFBGA | Mounting Type: Surface Mount | Supply Voltage: 1.283V ~ 1.45V | Memory Size: 2G | Operating Temperature: 0°C ~ 95°C (TC) | Number of Pins: 96 | Organization: 128Mx16
EDB1332BDBH-1DAAT-F-RMicron Technology Inc.Package: FBGA | Mounting Type: Surface Mount | Supply Voltage: 1.2 V | Interface: Parallel | Number of Pins: 134