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Micron Technology Inc. EDB4432BBBJ-1D-F-ES-D DRAM

DRAM Memory IC 4G HSUL

In StockMicron Technology Inc.WFBGARoHS
EDB4432BBBJ-1D-F-ES-D WFBGA package illustration

Same model may have multiple batches, images only for reference.

EDB4432BBBJ-1D-F-ES-D
Part Number (MPN)
EDB4432BBBJ-1D-F-ES-D
Detailed Description
DRAM Chip Mobile LPDDR2 SDRAM 4Gbit 128Mx32 1.2V/1.8V 134-Pin WFBGA
Package
WFBGA
Lifecycle Status
Obsolete
RoHS State
RoHS Compliant
Datasheet
PDF EDB4432BBBJ-1D-F-ES-D Datasheet
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Technical Specifications

Micron Technology Inc. EDB4432BBBJ-1D-F-ES-D DRAM technical specifications.

General

Interface
HSUL
Memory Size
4G
RoHS
Compliant
Number of Pins
134
Mounting Type
Surface Mount
Operating Temperature
-30 ~ 85
Supply Voltage
1.14/1.7 ~ 1.3/1.95
Lifecycle Status
Obsolete
Organization
128Mx32
PPAP
No

Related Parts Comparison (EDB4432BBBJ-1D-F-ES-D vs EDB5432BEBH-1DIT-F-D vs EDB130ABDBH-1D-F-D vs EDB1316BDBH-1DAUT-F-D)

Side-by-side specifications of related catalog parts.

Engineering verification required. Related parts may have different electrical ratings, pinouts, footprints, and operating limits. Verify suitability for your circuit before substitution.

This PartRelated PartRelated PartRelated Part
Mounting TypeSurface MountSurface MountSurface MountSurface Mount
Operating Temperature-30 ~ 85-40°C ~ 85°C (TC)-30°C ~ 85°C (TC)-40°C ~ 125°C (TC)
Supply Voltage1.14/1.7 ~ 1.3/1.951.14V ~ 1.95V1.14V ~ 1.95V1.14V ~ 1.95V
Memory Size4G512 Mbit1Gbit1Gbit
RoHSCompliantROHS3 CompliantROHS3 CompliantROHS3 Compliant
Lifecycle StatusObsoleteObsoleteObsoleteActive
Number of Pins134--134134
Dram TypeMobile LPDDR2 SDRAM--Mobile LPDDR2 SDRAMMobile LPDDR2 SDRAM
Organization128Mx3216 M x 32--64Mx16
Supplier PackageWFBGA--FBGAFBGA
Package / Case--134-VFBGA134-VFBGA134-VFBGA
Clock Frequency--533 MHz533 MHz533 MHz
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