Microchip Technology VSC8582XKS-09 Telecom
IC TELECOM INTERFACE
Same model may have multiple batches, images only for reference.
Manufacturer
Part Number (MPN)
VSC8582XKS-09
Detailed Description
IC TELECOM INTERFACE
Package
256-BGA
Key Features
Package / Case: 256-BGA; Mounting Type: Surface Mount
Lifecycle Status
Active
RoHS State
RoHS Compliant
Datasheet
VSC8582XKS-09 Datasheet
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Technical Specifications
Microchip Technology VSC8582XKS-09 Telecom technical specifications.
General
Interface
GMII, SerDes, SPI, TBI
Package / Case
256-BGA
Mounting Type
Surface Mount
Operating Temperature
-40°C ~ 125°C
Supply Voltage
1V
Lifecycle Status
Active
Number of Circuits
1
Function
Ethernet
Alternate Parts Comparison (VSC8582XKS-09 vs VSC8584XKS-06 vs VSC8562XKS-11 vs VSC8504XKS-01)
Side-by-side technical parameter comparison of related primary models in this product family.
| This Part | Alternate Parts | Alternate Parts | Alternate Parts | |
|---|---|---|---|---|
| Package / Case | 256-BGA | 256-BGA | 256-BGA | 256-BGA |
| Mounting Type | Surface Mount | Surface Mount | Surface Mount | Surface Mount |
| Lifecycle Status | Active | Active | Active | Obsolete |
| Supply Voltage | 1V | -- | -- | 1V |
| Function | Ethernet | -- | -- | Ethernet |
| Number of Circuits | 1 | -- | -- | 1 |
| Operating Temperature | -40°C ~ 125°C | -- | -- | -- |
| Interface | GMII, SerDes, SPI, TBI | -- | -- | -- |
| Action |
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