Microchip Technology PM5316-BGI Telecom
SPECTRA 4X155 SONET/SDH Payload
Same model may have multiple batches, images only for reference.
Manufacturer
Part Number (MPN)
PM5316-BGI
Detailed Description
SPECTRA 4X155 SONET/SDH Payload
Package
520-LBGA Exposed Pad
Key Features
Package / Case: 520-LBGA Exposed Pad; Mounting Type: Surface Mount
Lifecycle Status
Active
RoHS State
RoHS Compliant
Datasheet
PM5316-BGI Datasheet
Quick Jump:
Technical Specifications
Microchip Technology PM5316-BGI Telecom technical specifications.
General
Interface
Bus
Package / Case
520-LBGA Exposed Pad
Mounting Type
Surface Mount
Operating Temperature
-40°C ~ 85°C
Supply Voltage
3.14V ~ 3.47V
Current Supply
860mA
Functions
SONET/SDH
Number of Circuits
1
Alternate Parts Comparison (PM5316-BGI vs PM8650A1-FEI vs PM8363-NI vs PM8354A-NI)
Side-by-side technical parameter comparison of related primary models in this product family.
| This Part | Alternate Parts | Alternate Parts | Alternate Parts | |
|---|---|---|---|---|
| Package / Case | 520-LBGA Exposed Pad | -- | 196-LBGA | 289-BGA |
| Mounting Type | Surface Mount | Surface Mount | Surface Mount | -- |
| Operating Temperature | -40°C ~ 85°C | -- | -40°C ~ 125°C | -40°C ~ 125°C |
| Supply Voltage | 3.14V ~ 3.47V | -- | 1.71V ~ 1.89V | 1.8V, 2.5V |
| Interface | Bus | -- | -- | Parallel/Serial |
| Current Supply | 860mA | -- | -- | 402mA |
| Functions | SONET/SDH | -- | -- | -- |
| Number of Circuits | 1 | -- | -- | -- |
| Protocol | -- | -- | Ethernet | Ethernet |
| Action |
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